Fixture for motor controller power substrate and motor controller incorporating

DETAILED DESCRIPTION In accordance with a first aspect of the invention, a fixture is provided for securing conducting pins to a power substrate module of the type including a rectifying circuit for converting alternating current power to direct current power, and inverting circuit for converting the direct current power to controlled alternating current power and conducting pads for transmitting power to and from the rectifying and inverting circuits.
The fixture includes a substantially planar support having a plurality of apertures for permanently receiving and retaining the conducting pins over corresponding conducting pads on the power substrate module.
The fixture is preferably made of an epoxy-fiberglass laminate material that is left on the conducting pins in the final assembly.
In accordance with another aspect of the invention, a power substrate assembly is provided for a motor controller.
The assembly includes a power substrate module including rectifying and inverting circuits and conducting pads coupled to the rectifying and inverting circuits for receiving conductors.
The assembly also includes a plurality of conductors secured to the conducting pads for transmitting power to and from the rectifying and inverting circuits and for transmitting control signals to the inverting circuit.
The assembly further includes a fixture having apertures for receiving and supporting the conductors over corresponding conducting pads on the power substrate module.
In accordance with a further aspect of the invention, a method for fabricating a power substrate assembly is provided, including a prelimiary step of forming a circuit on a power substrate module, the circuit including conducting pads for transmitting power to and from the circuit.
A substantially planar fixture is also formed, having apertures for receiving a plurality of conductors.
Solder material is deposited on the conducting pads, conductors are permanently inserted into the apertures in the fixture and the fixture is positioned over the power substrate module such that the conductors contact corresponding conducting pads