Heat frame for portable computer

DETAILED DESCRIPTION The present invention provides a portable computer including plurality of circuit boards mounted on a heat frame formed of an integral piece of material.
A portion of the heat frame is thermally coupled to a processor for removing heat therefrom and spreading the heat throughout the heat frame.
A housing contains the heat frame and circuit boards.
The present invention provides significant advantages over the prior art.
First, concentrations of heat around components such as the microprocessor are spread out over a large surface area to prevent hot spots.
Second, the heat frame draws heat away from areas which may be in contact with the user, such as the bottom surface of the housing which may rest on the user's lap.
Third, heat is dissipated to the air in areas which are generally inaccessible to the user.
Fourth, the heat frame reduces assembly and testing costs.
Fifth, the heat frame provides a superior EMI/RFI ground plane.