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 Heat sink

Details
Inventors: Kinoshita, Joji; Kinoshita, Takahiro;
Assignee: Yamato Corporation (Taipei, TW)
Primary Examiner: Tolin; Gerald
Assistant Examiner: Chervinsky; Boris L.
Attorney, Agent or Firm: Koda & Androlia

A heat sink comprising a plurality of cooling fins and a plurality of spacers. Each of the cooling fins is formed to assume a shape of letter L by bending a lower end of a metallic plate so that the bent portions serve as heat-collecting portions, and the spacers are provided between adjoining cooling fins for maintaining intervals between the cooling fins and for pressing the heat-collection portions of the cooling fins to the heat-radiating surface of an electronic component. The cooling fins and spacers are connected by connecting rods piercing through portions at which the fins and spacers are overlapped.

DETAILED DESCRIPTION The object of the present invention is to solve the above-described drawbacks presented in conventional heat sink.
It is another object of the present invention to provide a heat sink that has high heat-radiation effects, that is free of problems of cracks in electronic components owing to differences in thermal expansion coefficients, and that may be easily manufactured.
For this purpose, the heat sink of the present invention comprises a plurality of cooling fins each formed to assume a shape of letter L by bending a lower end of a metallic plate so that these bent portions serve as heat-collecting portions, and a plurality of spacers provided between adjoining cooling fins for maintaining intervals between the cooling fins and for pressing the heat-collecting portions of the cooling fins to a heat-radiating surface of an electronic component, wherein the cooling fins and spacers are connected by connecting rods piercing through portions at which the fins and spacers are overlapped.
With this arrangement, even in the presence of swells in the heat-radiating surface of the electronic component, the heat sink can deform in correspondence to the condition of the heat-radiating surface so as to conform to the heat-radiating surface so that the heat-collecting portions of the cooling fins are fitted along the heat-radiating surface of the electronic component.
It is preferable to form projections in the heat-radiating portions of the cooling fins.
With the projections in the heat-radiating portions of the cooling fins, not only can the heat-radiating effects be improved by the increased contact surfaces with air but also the intervals between the cooling fins can be maintained consistently even when warping deformation occurs in the cooling fins by heat.
In addition, it is preferable to form convex portions on surfaces of the spacers and to form holes in the cooling fins at portions corresponding to the convex portions so that the convex portions of the spacers are fitted in the holes of the cooling fins



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