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 Laser ablation apparatus

Details
Inventors: Yoshida, Yoshikazu; Mizuguchi, Shinichi;
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
Primary Examiner: Scott, Jr.; Leon
Assistant Examiner:
Attorney, Agent or Firm: Wenderoth, Lind & Ponack

A laser ablation apparatus includes a laser oscillator, a condenser lens for condensing a laser light generated from the oscillator, a rotary cylindrical target having a side face which is illuminated by the laser light, a driving device for rotating the target, a substrate carrier device for moving a substrate in a direction parallel to a tangential direction of the cylindrical target, and a vacuum chamber located above the substrate. The vacuum chamber encloses a part of the cylindrical target, and has an open laser inlet port so that the side face of the target is illuminated by the laser light passing through the laser inlet port to adhere material evaporated from the target to the substrate when the substrate passing through the vacuum chamber.

DETAILED DESCRIPTION An essential object of the present invention is therefore to provide a laser ablation apparatus which can project a laser light between a substrate capable of being continuously transported and a rotary cylindrical target a part of or the whole of which is enclosed by a vacuum chamber of a differential evacuating system.
In accomplishing this object, according to one aspect of the present invention, there is provided a laser ablation apparatus comprising: a laser oscillator; a condenser lens for condensing a laser light generated from the oscillator; a rotary cylindrical target a side face of which is illuminated by the laser light; a driving device for rotating the target; a substrate carrier device for moving a substrate in a direction parallel to a tangential direction of the cylindrical target; and a vacuum chamber located above the substrate, enclosing a part of the cylindrical target, and having an open laser inlet port so that the side face of the target is illuminated by the laser light passed through the laser inlet port to adhere material evaporated from the target to the substrate when the substrate passes through the vacuum chamber.



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