Tape ball lead integrated circuit package

DETAILED DESCRIPTION As will be described in more detail hereinafter, an integrated circuit package assembly utilizing both leads and a grid array of contacts attached to the bottom of the package to provide an arrangement for electrically connecting the integrated circuit package to other electrical elements is disclosed.
The integrated circuit package includes a dielectric flex tape substrate having a horizontal top surface, a horizontal bottom surface, a plurality of contact terminals on the bottom surface of the flex tape substrate, a plurality of terminal pads on the top surface of the flex tape substrate, and a plurality of traces.
Each of the traces electrically connects a respective one of the contact terminals on the bottom of the substrate to an associated one of the terminal pads on the top surface of the substrate.
An integrated circuit die is supported by the top surface of the flex tape substrate and the integrated circuit die includes a plurality of input/output terminals.
A plurality of electrically conductive leads are supported by the top surface of the flex tape substrate and are electrically isolated from the traces of the flex tape substrate.
The electrically conductive leads are adapted to electrically connect certain ones of the plurality of input/output terminals of the integrated circuit die to external electrical elements.
An array of electrically conductive contacts are attached to the contact terminals on the bottom surface of the flex tape substrate.
The contacts are adapted to electrically connect certain other ones of the plurality of input/output terminals of the integrated circuit die to external electrical elements.
A first array of bonding wires electrically connects the certain ones of the plurality of input/output terminals of the integrated circuit die to associated one of the electrically conductive leads supported on the top surface of the flex tape substrate.
A second array of bonding wires electrically connects the certain other ones of the plurality of input/output terminals of the integrated circuit die to associated ones of the terminal pads on the top surface of the flex tape substrate