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Hydraulic reservoir for tandem master cylinder
An object of this invention is to provide a novel hydraulic reservoir for master cylinder which fulfils well the above described requirements. Another object of this ...
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Semiconductor device
We have investigated the aforementioned semiconductor devices of the prior art and have found the following problems: (1) In the semiconductor device of the prior art, ...
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Tape ball lead integrated circuit package
As will be described in more detail hereinafter, an integrated circuit package assembly utilizing both leads and a grid array of contacts attached to the bottom of the ...
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Transmission unit receiving and storing means
OF EMBODIMENTS] In the following, the present invention shall be described by way of preferred embodiments. FIG. 1 shows a schematic outline of a general embodiment of ...
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Computer enclosure with embedded PCMCIA modem card
The present invention solves the shortcomings and deficiencies of the prior art by constructing an embedded internal DAA PCMCIA Modem that includes a standardized input/...
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IC card and IC card system
The present invention is directed to overcome the foregoing problems, and therefore an object of the present invention is to provide an IC card and an IC card system ...
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Card type semiconductor device
The invention solves the above problems of the conventional devices and methods discussed above. Accordingly, an object of the invention is to provide a card type ...
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System and method for interconnection of computer peripherals via multiple interfaces
OF THE INVENTION Reference will now be made to the drawings in which the various elements of one preferred embodiment of the present invention will be given numerical ...
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Heat frame for portable computer
The present invention provides a portable computer including plurality of circuit boards mounted on a heat frame formed of an integral piece of material. A portion of ...
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Method of swapping auxiliary storage devices using a suspend mode
The present invention has been made in an effort to solve the above problems. It is an object of the present invention to provide a method of performing a warm swap of ...
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I/O Systems 
