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Apparatus-and-method-for-inspection-of-high-component-density-printed-circuit-board

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Apparatus and method for inspection of high component density printed circuit board

Details

Inventors: Sepai, Dinyar; Daly, Kevin R.; Whalen, Brian L.; Hong, Khanh; Jones, George B.;
Assignee: Raytheon Company (Lexington, MA)
Primary Examiner: Boudreau; Leo H.
Assistant Examiner: Bella; Matthew C.
Attorney, Agent or Firm: Dawson; Walter F.

An automated electronic module inspection system having illumination sources that produce digitized gray scale images that are then analyzed by a computer. The inspection system illuminates the module including solder joints, components and printed circuit board using a sequence of illumination that produce visual images which are used to identify defects. The inspection system inspects for all defects as specified in MIL-STD-2000A (Section 4.4) by using both surface reflectance properties as well as topological properties of objects. The system comprises two video cameras. A positioning table aligns a module-under-test with the optical axis of each camera thereby enabling the same field-of-view to be observed under different lighting conditions. A dark field illumination associated with a first camera preferentially illuminates non-flat surfaces, but not vertical surfaces. A bright field illumination associated with a second camera preferentially illuminates relatively flat surfaces. The flat-surface illumination light source is collimated with the optical axis of the camera using a conventional partially reflecting angled mirror that reflects the light along the camera's optical axis onto a circuit board of the module. The angled surfaces are illuminated using four ring-lights concentrically aligned with the optical axis of the second camera. The images observed by the camera are then analyzed by inspection programs for discrepancies between image model attributes and the images, and such programs provide compensation for nonuniformities of the light sources and cameras and compensation of shadows resulting from the dark field illumination light source.

DETAILED DESCRIPTION Accordingly, it is therefore an object of this invention to use a visual spectrum sensor to view a solder joint in order to extract reflectance properties as well as topological properties.
It is a further object of this invention to perform an automated visual inspection of all solder joints on a surface mounted technology printed circuit board which is capable of identifying all defect categories specified in Section 4.
4 of MIL-STD-2000A.
It is a further object of this invention to perform an automated visual inspection of a printed circuit board and the components thereon in accordance with the defect categories specified in Section 4.
4 of MIL-STD-2000A.
The objects are further accomplished by providing an apparatus for inspection of an electronic module comprising means for positioning the module during the inspection, a first light source positioned in accordance with the positioning means above the module for illuminating the module, a first sensing means disposed above the first light source means for sensing an intensity of reflected light from the first light source to obtain a first image, a second light source positioned in accordance with the positioning means above the module for illuminating the module, a second sensing means disposed above the second light source means for sensing an intensity of reflected light from the second light source to obtain a second image, processing means for compensating the first image for nonuniformities resulting from the first light source and the first sensing means and for compensating the second image for nonuniformities resulting from the second light source and the second sensing means, the processing means further comprises means for compensating the first image for shadows from the first light source, means included in the processing means for performing a two dimensional intensity transformation on the first image and the second image for establishing a three-dimensional topography of the module, and means included in the processing means for analyzing the three-dimensional topography and the intensity of reflected light to determine the condition of the module

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