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Method-and-apparatus-for-examining-printed-circuit-board-provided-with-miniaturized-electronic-parts

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Description:...

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Method and apparatus for examining printed circuit board provided with miniaturized electronic parts

Details

Inventors: Suzuki, Etsuji; Uno, Shinichi; Chiyoda, Kiyomu; Douji, Ryuhachirou;
Assignee: Tokyo Shibaura Denki Kabushiki Kaisha (Tokyo, JP)
Primary Examiner:
Assistant Examiner:
Attorney, Agent or Firm:

The rear and front surfaces of a printed circuit board are illuminated by parallel light beams from first and second illuminating systems, respectively. The obtained transmitted light and reflected light are received by an image sensor through a lens system to provide video data which is stored in a video memory. Abrasion scars are formed by brushing the surfaces of terminals formed on the front surface of the printed circuit board prior to soldering. The presence or absence of a chip element is discriminated by a microprocessor in accordance with the difference between reflection factors of light emitted by the second illuminating system and reflected from the terminals and light reflected from the chip element.

DETAILED DESCRIPTION It is an object of the present invention to provide a method and an apparatus for allowing easy and reliable examination of chip elements mounted on a printed circuit board.
In order to achieve this object, there is provided a method and an apparatus for examining a printed circuit board, which utilize the fact that, when a chip element is mounted on a printed circuit board having some degree of transparency, the combined level of reflected light of light obliquely incident on the surface of the printed circuit board, on which the chip element is mounted in the direction perpendicular to the abrading direction of printed conductors, together with transmitted light through the printed circuit board, becomes extremely low at the portion of the chip element.

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