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Method and apparatus for inspecting a workpiece
| Details |
Inventors: Roy, Rajiv; Zemek, Michael C.; Wahawisan, Weerakiat;
Assignee: Semiconductor Technologies & Instruments, Inc. (Plano, TX)
Primary Examiner: Pham; Hoa Q.
Assistant Examiner:
Attorney, Agent or Firm: Akin, Gump, Strauss, Hauer & Feld, LLP
A computer vision apparatus and methods for automatically inspecting 2-dimensional (2D) and 3-dimensional (3D) criteria of objects using a single camera and laser sources. A camera views the object under inspection which is illuminated by a first source of light to highlight the region of interest. This provides image data for 2d analysis by a computer coupled to the system. Subsequently, multiple laser sources mounted on a positioner provide the illumination for collecting images for 3 dimensional analysis. A computer with a monitor is connected to the camera to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays (BGAs) packages and Quad Flat Packages (QFPs) packages for package mark inspection, package defect inspection, and solder ball or lead defects. Further, the apparatus and methods of the invention can be applied to the inspection of chip sized packages and to Flip-Chip Bump, and I.C. Die inspection. The system can also be used to inspect bond wire Wire Loop Height and to perform automated Quality Inspection for critical assembly of disk-drives, CD-Roms, keyboards, other assemblies in the computer industry and in other industries. |
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DETAILED DESCRIPTION What is claimed is: 1.
A system for the inspection of a workpiece, the system comprising in combination: a camera held in a position facing the workpiece; a ring light positioned to shine on the workpiece from all sides of the camera; at least one linear positioner which can move toward the camera and away from the camera; and at least one laser mounted on the at least one linear positioner at an angle to the direction faced by the camera, wherein the linear positioner can move to a position wherein the laser is aimed at the workpiece.
2.
A system according to claim 1 wherein the at least one linear positioner comprises four linear positioners placed on four different sides of the camera, and the at least one laser comprises four lasers, one laser mounted on each of the four linear positioners.
3.
A system according to claim 2 further comprising a computer controlling the camera, the ring light, the linear positioners, and the lasers.
4.
A system according to claim 2 wherein the workpiece has a substantially flat rectangular top surface and a substantially flat rectangular bottom surface and four edges connecting the two substantially flat surfaces, with a row of electrical leads extending from each of the four edges, and wherein the camera faces one of the substantially flat rectangular surfaces, and the four linear positioners approach the camera from directions which are perpendicular to the four edges of the workpiece and can move to positions wherein the lasers are aimed at the rows of electrical leads.
5.
A system according to claim 4 wherein each laser projects a flat beam directly across a row of electrical leads.
6.
A system according to claim 4 wherein each laser sweeps a beam directly across a row of electrical leads.
7.
A system according to claim 3 wherein the workpiece has a substantially flat rectangular top surface and a substantially flat rectangular bottom surface and four edges connecting the two substantially flat surfaces, with a row of electrical leads extending from each of the four edges, and wherein the camera faces one of the substantially flat rectangular surfaces, and the four linear positioners approach the camera from directions which are perpendicular to the four edges of the workpiece and can move to positions wherein the lasers are aimed at the rows of electrical leads
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Image Analysis 
