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Optical-inspection-method-with-side-viewing-mirror

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Optical inspection method with side-viewing mirror

Details

Inventors: Kempf, Paul S.;
Assignee: Kempf; Paul Stuart (); Pilar Moreno Kempf Family Trust ()
Primary Examiner: Henry; Jon W.
Assistant Examiner:
Attorney, Agent or Firm: Brown, Martin, Haller & Meador

An optical inspection method particularly suitable for viewing objects such as components on printed circuit boards, comprises the steps of viewing an object from above with a magnifying optical device and at the same time placing a side-viewing mirror in the optical path of the optical device facing the side of the object and tilted at an angle up to 90 degrees to the optical path so as to rotate an image of the side of the object by at least 90 degrees to present simultaneous front and side views of the object to an observer.

DETAILED DESCRIPTION It is an object of the present invention to provide an improved method and apparatus for inspecting components on printed circuit boards and the like, which allows the top and sides of the components to be inspected.
According to a first aspect of the present invention, an optical inspection method is provided which comprises the steps of viewing an object form above using a magnifying optical instrument and simultaneously placing a side-viewing mirror in the optical path of the instrument and facing the side of the object, with the bottom edge of the mirror contiguous with the object plane, and tilting the mirror to an angle up to ninety degrees to the optical path so as to rotate an image of the side of the object by at least 90 degrees and present simultaneous top and side views of the object to the viewer.
This method permits viewing of the object through a magnifying optical instrument from the top and also at 90 degrees to the optical path while keeping both viewing directions in focus simultaneously.
The observer can inspect the PCB components from all sides up to 90 degrees, and will be able to see the solder joints beneath components having J lead connections.
The method can also be used on programmable X-Y tables to permit computerized fault location, by holding the side viewing mirror in the optical path against the board as the board scans past in the X or Y direction.
According to another aspect of the present invention a side-viewing mirror device designed for use in the above inspection method is provided.
The side viewing mirror device according to the invention comprises a front surface mirror having a reflective front surface and a non-reflective rear surface, and at least one edge shaped to conform to the shape of the object plane, so that it can be placed with its edge contiguous to that plane facing the side of an object to be inspected.
The edge is straight in the preferred embodiment so that it can be placed against a printed circuit board (PCB) with the mirrored front surface facing the side of a component on the board

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