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Solder-bump-measuring-method-and-apparatus

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Solder bump measuring method and apparatus

Details

Inventors: Hashimoto, Yutaka; Sasaki, Hideaki; Kobayashi, Mamoru; Kazui, Shinichi;
Assignee: Hitachi, Ltd. (Tokyo, JP)
Primary Examiner: Heinrich; Samuel M.
Assistant Examiner:
Attorney, Agent or Firm: Fay, Sharpe, Beall, Fagan, Minnich & McKee

A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

DETAILED DESCRIPTION It is an object of the present invention to provide a method and apparatus capable of measuring bumps on a work correctly at high speed.
The measuring method of this invention comprises the steps of: mounting a work to be measured on a table, the work having solder bump rows; detecting a reference bump from the solder bumps by using a laser optical micro head; scanning the solder bump rows with the optical micro head and detecting a shift amount of a mount posture of the work; correcting the shift amount of the mount posture of the work by scanning the table; and measuring height positions of apexes of all the solder bumps with the optical micro head.
The method of the invention further comprises the steps of calculating a regression plane formed by the apexes of the solder bumps and calculating a relative apex position of each solder bump relative to the calculated regression plane.
The method of the invention further comprises the steps of calculating a standard deviation of relative heights and judging from the standard deviation and the apex height of each bump whether the work is defective or not.
A measuring apparatus of this invention comprises: a table for placing thereon a work to be measured, the work having solder bump rows; moving means for moving the table in a two-dimensional plane in two perpendicular axis directions; rotating means for rotating the table about a vertical axis; inclining means for inclining the table; a laser optical micro head mounted on the table to be movable in the vertical axis direction; a personal computer for recording data measured by the optical micro head in the form of digital data; controlling means for controlling the table and the optical micro head; a personal computer for calculating a height position of an apex of each solder bump in accordance with the data measured by the optical micro head; a display screen for displaying the calculated results; and a printer for printing out the calculated results.
According to the present invention, a work is measured by scanning a light spot by the optical micro head

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