Split optics arrangement for vision inspection/sorter module

DETAILED DESCRIPTION What is claimed is: 1.
In a method of determining lead integrity of IC devices having leads, comprising the steps of: providing illumination of the leads; producing a back lit outline of at least one side of the IC device to create a silhouette of the leads; simultaneously recording the image of three orthogonal views of the IC device leads with a single camera.
2.
The method of claim 1 wherein both sides of said device are backlit simultaneously.
3.
The method of claim 1 further comprising the step of recording the image of the top of the device with the single camera.
4.
Apparatus for inspecting the leads of an IC device by illuminating the leads and recording the image thereof with a camera, converting the recorded image into an electrical signal and determining the integrity of leads based upon said electrical signal, wherein the improvement comprises: means for illuminating said IC devices; an optical arrangement operable to simultaneously record images of said IC device in three orthogonal directions; means for recording said images with a single camera; means for converting said images into electrical signals; means for comparing said electrical signals with stored dimensional standards.
5.
Apparatus for inspecting the leads of an IC device by illuminating the leads and recording the image thereof with a camera, converting the recorded image into an electrical signal and determining the integrity of leads based upon said electrical signal, wherein the improvement comprises: at least one diffusion prism disposed beneath the IC device which creates a backlit image of the leads comprising light transmitted directly to the camera and light reflected by a mirror set at an angle which directs back lit image light from the at least one diffusion prism toward the camera, whereby images of the IC device leads are simultaneously recorded in three orthogonal direction.
6.
Apparatus in accordance with claim 1 wherein the prism is laterally adjustable to inspect IC devices of varying widths