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Vapor-cooled-semiconductor-device-enclosed-in-an-envelope-having-a-compression-mechanism-for-holding-said-device-within-said-envelope

Component shape recognition method

An object of the present invention is to provide a component shape recognition method which enables ...

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To overcome the limitations in the prior art described above, and to overcome other limitations ...

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OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram to show one embodiment of the invention. In ...

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FIG. 1 is an illustration of a typical hardware layout according to an embodiment of the invention....

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We claim: 1. A pattern recognition system comprising: video camera means for generating a video ...

Reflector for multiple source lighting fixture

The present invention provides an improvement in lighting fixtures which permits the pattern and ...

Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope

Details

Inventors: Kimura, Yoshio; Mitsuoka, Hiroshi; Hosono, Isamu;
Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JA)
Primary Examiner: James; Andrew J.
Assistant Examiner:
Attorney, Agent or Firm: Wenderoth, Lind & Ponack

A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is immersed into a cooling liquid boilable adjacent the operating temperature of the semiconductor element. A pressing plate fixed to the opposite side wall resiliently presses the closure block to apply a compressible contact force to the semiconductor element. The stack may be sandwiched between two closure blocks closing the opposite opening on the bilateral walls of the lower envelope portion and pressed toward each other by two spherical segment of resilient material arranged back-to-back. Alternatively the stack may be carried between the bilateral envelope walls through a resilient spherical segment.

DETAILED DESCRIPTION Accordingly it is a general object of the present invention to eliminate the disadvantages of the prior art practice as above described.
It is an object of the present invention to provide a new and improved, vapor cooled semiconductor device simple in construction, small in size, light in weight and simplified in assembling.
It is another object of the present invention to provide a vapor cooled semiconductor device including an improved enclosed envelope small in size.
It is still another object of the present invention to provide a new and improved structure of a vapor cooled semiconductor device suitable for a small number of semiconductor elements or a single semiconductor element.
The present invention accomplishes these objects by the provision of a vapor cooled semiconductor device comprising, in combination, an envelope including an opening, a semiconductor stack including at least one semiconductor element sandwiched between a pair of heat dissipation blocks, the semiconductor stack being disposed within the envelope, means for hermetically closing the opening of the envelope and simultaneously pressurizing and holding the semiconductor stack within the envelope, and an amount of a cooling liquid charged in the envelope hermetically enclosed with the closing means to leave a space within the envelope whereby the semiconductor stack is cooled through the utilization of the latent heat of vaporization of the cooling liquid.

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