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Appearance-inspection-apparatus-and-appearance-inspection-method-of-electronic-components

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Appearance inspection apparatus and appearance inspection method of electronic components

Details

Inventors: Tokura, Nobufumi;
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
Primary Examiner: Pham; Hoa Q.
Assistant Examiner:
Attorney, Agent or Firm: Ratner & Prestia

A camera is part of an appearance inspection apparatus which observes electronic components soldered to a printed circuit board from a position located directly above the electronic components. The apparatus includes an illuminating light which is emitted toward the electronic components. A laser beam which is emitted from a laser oscillator to an emission area overlaps a viewing field of a camera. The camera is for acquiring image data of the electronic component. Also included is a photo sensor which is disposed obliquely above the emission area which receives the reflected light of the laser beam which has been reflected by the solder. Also included is a moving apparatus for moving the printed circuit board in a horizontal direction relative to the camera and laser oscillator. The image data is acquired and the solder height is measured at substantially the same time. As a result, inspection time is shortened.

DETAILED DESCRIPTION The present invention relates to substantially shortening the time required for conducting the appearance inspection of electronic components soldered to a printed circuit board.
The appearance inspection apparatus of electronic components includes a camera for observing an electronic component adhered by solder to a printed circuit board.
Also included is a light source for emitting an illuminating light toward the electronic component and a light emitter for emitting a measuring light to an emission area which overlaps the viewing field of the camera.
A photo sensor is provided for receiving the reflected measuring light reflected by the solder which had been emitted from the light emitter disposed obliquely above the emission area.
Also included is a moving apparatus for moving the printed circuit board and camera in the horizontal direction relatively to the light emitter.
Using the above configuration, the viewing field of the camera and the emission area of the measuring light are overlapped because the electronic component is positioned in the viewing field of the camera and the emission area of the measuring light by driving the moving apparatus.
Therefore, the appearance inspection of the electronic component and solder by the camera and the inspection of the solder by the measuring light can be done without moving the printed circuit board twice.
Hence, the number of times the moving apparatus moves the electronic components is reduced to half, and the time required for the appearance inspection of one printed circuit board is notably shortened.
The present invention further relates to an inspection method for inspecting electronic components which includes setting the viewing field of the camera provided above a printed circuit board and the emission area of a laser beam emitted from a laser oscillator so as to overlap each other.
Then, driving a moving apparatus to move the printed circuit board horizontally relatively to the camera and laser oscillator so as to position an electronic component soldered to the printed circuit board in the viewing field and emission area Next, the method includes acquiring image data of the electronic component by the camera to be stored in a memory and measuring the solder height by a laser beam and storing the measured height data in the memory

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