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Home LCD Electrically-conductive-pressure-sensitive-adhesive-tape

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 Electrically conductive pressure-sensitive adhesive tape

Details
Inventors: Calhoun, Cylde D.; Fleming, Maurice J.; Foss, George D.; Renstrom, Richard L.;
Assignee: Minnesota Mining and Manufacturing Company (St. Paul, MN)
Primary Examiner: Davis; Jenna L.
Assistant Examiner:
Attorney, Agent or Firm: Griswold; Gary L., Kirn; Walter N., O'Shaughnessy; Christine T.

Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 .mu.m thick.

DETAILED DESCRIPTION For most applications of the novel tape, the breadth of the dots formed in step 1,) of the above 2-step process should be small enough that only one equiax particle is attracted to each position, but when each dot is large enough to make it fairly certain that there will be a particle at every dot, it can be expected that two or possibly three particles will be deposited side by side at a few positions.
When only one equiax particles per dot is desired, each dot preferably is roughly circular and has a diameter within the range of 30 to 90% of the diameter of the equiax particles.
When using spherical particles 55 .
mu.
m in diameter, good results have been attained with dots 45 .
mu.
m in diameter.
When the diameter of the dots substantially exceeds the diameter of the equiax particles, a monolayer of several particles may be attracted to each dot.
Preferably the dots and the particles they attract are as widely spaced as possible while still providing the desired conductivity through the adhesive layer.
Wide spacing provides the strongest possible bonding as well as economy, especially when the particles include expensive material such as silver or gold.
Wide spacing of the particles also ensures that the adhesive layer of the novel tape is laterally nonconductive and can be used for making electrical connections between two arrays of electrical terminals without any danger of shorting closely spaced electrodes.
To this end, the electrically conductive equiax particles preferably occupy no more than about 5% of the area of the adhesive layer of the novel tape, and more preferably occupy from 0.
05 to 1.
0% of that area.
The electrically conductive particles may be arranged in rows extending both longitudinally and laterally over the full area of the adhesive layer, so that there is no need to align pieces of the tape with substrates to which they are to be adhered.
However, to form electrical connections at specific locations, e.
g.
, to pads of an integrated circuit chip, the electrically conductive particles may be positioned only in areas of the tape that will contact the pads, the other areas of the tape preferably being substantially free from the particles



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