Method for manufacturing a cathode tip of electric field emission device

DETAILED DESCRIPTION It is an object of the present invention to provide a method for manufacturing a cathode tip which is cheap and uniform in its shape.
The method for manufacturing a cathode tip includes steps of depositing conductive layer and undoped silicon layer on the insulator substrate sequentially; forming a tip-mask pattern on the selected area of top of said undoped silicon film and etching said undoped silicon film isotropically and then anisotropically in turn, so that the silicon film is formed as cone-like having cylinder; and removing the tip-mask pattern, implanting ion into the etched undoped silicon layer and removing the ion implanted silicon layer using the wet etch process.
The above and further objects, aspects and novel features of the invention will become more apparent from the following detailed description when read in connection with the accompanying drawings.