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Positive type radiation-sensitive resin composition comprising a photosensitizer and a novolak resin
| Details |
Inventors: Oka, Hiroshi; Okuda, Chozo; Yoshida, Yoshinori; Takahashi, Toshihiko; Kamoshida, Yoichi; Miura, Takao;
Assignee: Japan Synthetic Rubber Co., Ltd. (Tokyo, JP)
Primary Examiner: Bowers, Jr.; Charles L.
Assistant Examiner: Doody; Patrick A.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt
A positive type radiation-sensitive resin composition comprising an alkali-soluble novolac resin and a 1,2-quinonediazide compound, characterized in that said alkali-soluble novolac resin is a resin produced by condensing a carbonyl compound and a phenol mixture comprising 6 to 94 mole % of m-cresol and 94 to 6 mole % of at least one compound represented by the formula (I) other than m-cresol: ##STR1## wherein X is --CH.sub.3, --C.sub.2 H.sub.5, --C(CH.sub.3).sub.3, --CO.sub.2 CH.sub.3 or --CO.sub.2 C.sub.2 H.sub.5 ; n is an integer satisfying 3.gtoreq.m.gtoreq.1; and m is an integer satisfying 3.gtoreq.m.gtoreq.1, in which resin when the polystyrene-reduced molecular weight is determined by a gel permeation chromatography using a monodisperse polystyrene as the standard, maximum values a, b and c present, respectively, in the molecular weight ranges of 6,300 to 25,000, 2,500 to 6,000 and 150 to 900 in the molecular weight distribution curve obtained satisfy the following relationships: a/b=0-1.5 and c/b=1.4-2. Said positive type-radiation-sensitive resin composition is excellent in resolution, sensitivity, developability, thermal resistance and adhesion and hence is useful as a positive type resist for producing integrated circuits having a higher integration. |
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DETAILED DESCRIPTION What is claimed is: 1.
A positive type radiation-sensitive composition comprising: (a) an alkali-soluble novolac resin produced by condensing a carbonyl compound and a phenol mixture consisting essentially of 30-90 mole % of m-cresol and 70-10 mole % of at least one compound represented by the formula (I) other than m-cresol; ##STR4## wherein X is --CH.
sub.
3, --C.
sub.
2 H.
sub.
5, --C(CH.
sub.
3).
sub.
3 ; n is 1; and m is an integer satisfying 3.
gtoreq.
m.
gtoreq.
1, in which resin when the polystyrenereduced molecular weight is determined by a gel permeation chromatography using a monodisperse polystyrene as the standard, maximum values a, b and c present, respectively, in the molecular weight ranges of 6,300 to 25,000, 2,500 to 6,000 and 150 to 900 in the molecular weight distribution curve obtained satisfy the following relationships: a/b=0.
2-1.
3 c/b=0.
5-1.
5 and (b) a 1,2-quinonediazide compound comprising at least one 1,2-quinonediazidesulfonic acid ester of (poly)hydroxyphenyl aryl ketone selected from the group consisting of tetrahydroxybenzophenone, pentahydroxybenzophenone and hexahydroxybenzophenone in an amount sufficient to form a resist image upon irradiation and subsequent development.
2.
The positive type radiation-sensitive resin composition according to claim 1, wherein the phenyl aryl ketone is tetrahydroxybenzophenone.
3.
The positive type radiation-sensitive resin composition according to claim 1, wherein the at least one compound of formula (I) is selected from the group consisting of o-cresol, p-cresol, 3,5-dimethylphenol, 2,5-dimethylphenol, 2,3-dimethylphenol, 2,4-dimethylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, 2,3,5-trimethylphenol, 4-t-butylphenol, 2-t-butylphenol, 3-t-butylphenol, 3-ethylphenol, 2-ethylphenol, 4-ethylphenol, 2,3,5-triethylphenol, 3,5-diethylphenol, 2,5-diethylphenol and 2,3-diethylphenol.
4.
The positive type radiation-sensitive resin composition according to claim 1, wherein the at least one compound of the formula (I) is selected from the group consisting of p-cresol, 3,5-dimethylphenol and 2,3,5-trimethylphenol
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