Color corrector for embedded prisms |
| In carrying out principles of the present invention, in accordance with a preferred embodiment ... |
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Liquid-crystalline dielectric |
| OF THE INVENTION The reason for this highly advantageous effect is not yet clear. Possibly, the ... |
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Liquid crystal phase |
| We claim: 1. A liquid crystal phase having at least five liquid crystal components and a threshold ... |
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Light modulating material and method for preparing same |
| The invention is directed to improved, durable light modulating materials which are capable of ... |
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Cerium (IV) compound |
| OF THE PREFERRED EMBODIMENTS OF THE INVENTION More particularly according to this invention, in ... |
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Liquid crystal device with louver means located behind the liquid crystal device |
| I claim: 1. A display device comprising a liquid crystal cell reversibly switchable between light ... |
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Novel bistable light modulators and display element and arrays therefrom |
| What is claimed is: 1. A bistable light modulator which comprises: (a) a curved flexible membrane ... |
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Method and electrolytic display for selectively displaying an image |
| OF THE INVENTION The electrolytic display cell 10, shown in FIGS. 1 and 2 is an experimental cell ... |
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Lens support |
| It is a primary object of the present invention to provide a lens support free of the ... |
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Cascaded, dual cell transflective liquid crystal display |
| OF THE PREFERRED EMBODIMENTS FIG. 1 shows two cascaded liquid crystal cells 10 and 11 separated by ... |
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Probe card system and method
| Details |
Inventors: Anderson, James C.; Phillips, Brian P.; Honek, Charles;
Assignee: Xandex, Inc. (Petaluma, CA)
Primary Examiner: Nguyen; Vinh P.
Assistant Examiner:
Attorney, Agent or Firm: Townsend and Townsend and Crew
A semiconductor wafer probe test interface system (2) and method of operating the system. The wafer probe system includes a plurality of cassettes (302) adapted to hold wafer probe test cards (304). The cassettes are loaded into position for testing of semiconductor wafers with a transport assembly system (6). A memory device (316) on the cassette is used to store data regarding usage of the card such as number of wafer touchdowns. A smart controller (220) has the capability to "talk" to the prober and tester. |
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DETAILED DESCRIPTION An improved prober to test head interfacing system and method is provided by virtue of the present invention, otherwise referred to herein as an autoloader. The system provides for easy replacement of the probe card, and for a systematic method and device for probe card data collection. The autoloader system includes a prober, and a tester having a test head. A variety of wafer probe cards are mounted in removable cassettes. The cassettes are easily transported into and out of the prober without undocking the test head. A non-volatile or battery backed-up memory device is mounted on the probe card or the cassette. The memory device records various performance and operating data regarding the probe card including, for example, contact failures the location of the probes which failed, touchdowns, date of last repair/alignment, date of manufacture, and the like. The memory device is removed with and remains attached to the probe card or probe card cassette, even when the probe card is removed from the autoloader system. The memory device is preferably a serial device, preferably requiring only a single contact for data transmission, thus eliminating the need for a multi-pin connection. The memory may be polled either by the autoloader system (when inserted in the autoloader system) or in an auxiliary device located, for example, at a probe card maintenance station. When the data recorded on the probe card memory includes, for example, contact failure locations, it becomes easy to repair an individual probe card after it is removed from service for maintenance. Accordingly, it becomes possible to maintain a collection of diverse probe card types, while still maintaining performance data on individual cards. In addition, the invention provides a number of additional features. For example, the system allows for standardized tester interfaces, provides for probe card protection (in its cassette), and provides for motorized, repeatable probe tip to pad alignment. At the same time, the cassette system can be retrofitted to existing wafer probe systems or designed into new systems
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