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Liquid lamination process
OF THE INVENTION In the process of this invention photoresist films are applied to preimaged, patterned relief substrates by flooding the patterned relief surface with ...
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Sequential automatic registration and imagewise exposure of a sheet substrate
The present invention is directed to a process for registering and imagewise exposing a sheet substrate containing a photosensitive layer, with the use of a sequence of ...
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Matrix display device comprising two groups of row electrodes and two column electrodes for image element and its control process
More specifically, the present invention relates to a matrix display device comprising an electro-optical material having an optical property inserted between first and ...
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Array with metal scan lines controlling semiconductor gate lines
The invention addresses problems that affect arrays of circuitry formed on substrates. A two-dimensional (2D) array, for example, can include two sets of conductive ...
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Photoelectric converter apparatus
In view of the foregoing, the first object of this invention is to improve the light receiving sensitivity of photodiodes. The second object is to improve the frequency ...
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Image reading device with protective layers
An object of the present invention is to resolve such drawbacks and to provide an image reading device with improved durability, capable of relaxing the stress resulting ...
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Composite dielectric passivation of high density circuits
What is claimed is: 1. A method for the formation of a final passivation composite on an integrated circuit comprising the steps of: a) depositing an initial film of ...
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Method of making an assembly package having an air tight cavity and a product made by the method
Accordingly, it is an object of the present invention to provide a method of making an assembly package having an air tight cavity for housing an element therein which ...
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Amorphous silicon thin film transistor and method of preparing same
It is an object of the present invention to provide an amorphous silicon thin film transistor in which n.sup.+ -type layer is omitted, and in which there can be obtained ...
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Methods of forming semiconductor-on-insulator substrates
It is therefore an object of the present invention to provide improved methods of forming semiconductor-on-insulator substrates and devices and structures formed thereby....
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