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Integrated circuit placement device vacuum head
OF THE INVENTION, appended claims, and accompanying drawing. BRIEF DESCRIPTION OF THE DRAWING FIG. 1 is a side sectional view of a vacuum head in accordance with the ...
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Method and apparatus for handling parts
FIG. 1 illustrates an apparatus 10, in accordance with the invention, for removing a component 12 (best seen in FIG. 2) from a shipping tube 14 and then orienting the ...
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Non-circular piston rings
What is claimed is: 1. A piston ring for a non-circular engine cylinder, which cylinder has a wall contacted by the ring, the cylinder being in an engine which is in a ...
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Hand apparatus for holding article
The present invention has been made in consideration of the above situation, and has as its main object to provide a gripping apparatus capable of gripping a plurality ...
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Robotically loaded epitaxial deposition apparatus
OF THE PRESENT INVENTION In FIG. 1, a graphite susceptor 1 is shown as it would appear during the operation of loading and unloading semiconductor wafers 3. Susceptor 1 ...
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LCD error detection system
OF THE PRESENT INVENTION The present invention describes a liquid crystal display (LCD) device error detection system. In the following description, numerous specific ...
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Method of inspecting thin film transistor liquid crystal substrate and apparatus therefor
An object of the present invention is to provide an inspection method of a thin film transistor liquid crystal substrate and an apparatus therefor, wherein various short ...
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LCD panel test apparatus
Therefore, it is an object of the present invention to provide an LCD panel test apparatus which is capable of automatically testing an LCD panel to find out display ...
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Method and apparatus for testing an electrically conductive substrate
The present invention is directed to a method of testing an electrically conductive substrate. The method includes a step of contacting a surface of a sensing material ...
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Efficient debug package design
These needs are met by the invention, which provides a plurality of small probe apertures in the semiconductor die, with locations strategically chosen to allow access ...
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