Display apparatus having heat dissipation

DETAILED DESCRIPTION It is therefore the object of the present invention to solve the above stated problem and provide a display apparatus which is capable of efficiently dissipate heat developed by electronic components to the outside to suppress excessive heating of the temperature of the components, thereby preventing against lowering in display characteristics.
A display apparatus of the present invention comprising: a heat conductive substrate; electrically insulative members formed on respective surfaces of the heat conductive substrate; light emitting elements arranged in a matrix form on the surface of the electrically insulative member on one surface of the heat conductive substrate; and control components arranged on the surface of the electrically insulative member on the other surface of the heat conductive substrate.
Here, the light emitting element refers to as an electronic element such as an LED for radiating light, which involves a bare chip per se divided by a semiconductor substrate and light-source arrays formed on a substrate.
The heat conductive substrate means substrate in which the heat conductivity is obviously higher than that of a conventional printed board formed of glass-epoxy resin.
With such structure, the heat generated from light emitting elements or controlling components is allowed to conduct through the conductive substrate to be dissipated to the outside.
Accordingly, the temperature of the electronic components such as light emitting elements is prevented from rising to an excessively high temperature, and accordingly there is substantially no necessity of lowering the driving electric power for the electronic component.
Preferably, the electrically insulative member on the one surface is formed at least two layers of a first under layer and a second layer formed thereon, the first layer having an interconnect pattern formed on a surface thereof, the second layer being formed with blind through-holes through which the light emitting elements and the interconnect pattern are electrically connected