High intensity photocuring system

DETAILED DESCRIPTION The present invention is directed to a method and apparatus for curing photosensitive materials.
A photocuring assembly uses LEDs and an optical concentrator to generate high optical power intensities.
An LED array, comprising one or more LED assemblies, generates collimated light.
An optical concentrator, e.
g.
, a collection lens, focuses the collimated light to a desired spot size at a desired location.
In one embodiment, the photocuring assembly includes a cooling plenum at least partially defined by the collection lens.
The LED array of the photocuring assembly is at least partially disposed in the cooling plenum.
Therefore, a cooling fluid, such as air, cools the LED array by flowing through the cooling plenum defined by the collection lens.
In another embodiment, each LED assembly comprises a base and an LED insert detachably coupled to the base.
In yet another embodiment, the LED assemblies are detachably coupled to a mounting surface, such as a PCB.
Both embodiments enable a user to modify the operating wavelength of the photocuring assembly by replacing one or more LED inserts or assemblies having a first operating wavelength with one or more LED inserts or assemblies having a second operating wavelength.
In addition, damaged or defective LED inserts and/or assemblies may be replaced without necessitating the replacement of the entire LED array.
In another embodiment, the photocuring assembly includes a redirecting assembly disposed between the collection lens and the desired location.
Due to the emission properties of conventional LEDs, the LED assembly may not collimate some minority of the light.
As a result, the collection lens does not properly focus the non-collimated light exiting the LED array.
The redirecting assembly uses refraction or optical reflection techniques to redirect at least a portion of any unfocused light to the desired location to increase the intensity at the desired location.
Other embodiments of the present invention may include photocuring assemblies that comprise one or more of the above embodiments