DETAILED DESCRIPTION With reference to FIG. 7, a device 8 includes an integrated array of high power LEDs 10, 12, 14 mounted to respective electrically insulative submounts 20, 22, 24. The submounts 20, 22, 24 are secured to a metallic, rear side substrate 26 within respective wells 30, 32, 34. Optionally, the LEDs 10, 12, 14 are directly secured to the metallic substrate 26, thereby eliminating the use of submounts. The wells 30, 32, 34 in which the LEDs 10, 12, 14 reside are typically stamped or drilled directly into the substrate material to preferably form "reflector" shapes. However, other LED and well configurations are also contemplated. The submounts 20, 22, 24 (or optionally the LEDs 10, 12, 14) are secured to the rear side substrate 26, which acts as a heatsink, via a highly thermally conductive material (e. g. , solder, filled epoxies, heat tape and/or other thermally advantageous adhesives). The LEDs 10, 12, 14 are connected to electrical contacts 36 via conductors 38. Lenses 40, 42, 44 cover the respective LEDs 10, 12, 14. Optionally, a cap including a secondary optical lensing array is secured over the LEDs in the wells. In this case, the respective lenslets within the lensing array are mapped in a one-to-one relationship to the LEDs and the wells. The substrate 26 is secured to a heat spreader 60, which includes a thermally conductive material such as metal. During use, heat generated by the LEDs 10, 12, 14 is passed to the substrate 26 and then transferred to the heat spreader 60. The heat is distributed relatively evenly across the spreader 60. The spreader 60 is secured to a thermally conductive core 62. Thermally conductive fins 64 surround and extend from the core 62. In the illustrated embodiment, the fins 64 form an independent assembly that is interference fit with the core 62. In one embodiment, a tight interference fit is ensured by shrinking the core 62 and expanding the fins 64 prior to assembly. More specifically, the core's outer diameter is temporarily shrunk by cooling (e
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