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Integrated light pipe for a shielded housing
| Details |
Inventors: Tracy, James L.;
Assignee: Motorola, Inc. (Schaumburg, IL)
Primary Examiner: Kincaid; Kristine L.
Assistant Examiner: Horgan; Christopher
Attorney, Agent or Firm: Breeden; R. Louis
An electronic device (10) having a shielded housing (20) with an integrated light pipe (19 & 21) includes a substantially clear housing, a portion of which is arranged and constructed to form the integrated light pipe and plating (23), selectively applied to the substantially clear housing, to provide for effective electromagnetic interference shielding and to allow for sufficient light into the integrated light pipe. |
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DETAILED DESCRIPTION An aspect of the present invention is an integrated light pipe in a shielded housing, comprising a substantially clear housing, a portion of which is arranged and constructed to form the integrated light pipe.
The housing further comprises plating, selectively applied to the substantially clear housing, to provide for effective electromagnetic interference shielding and to allow for sufficient light into the integrated light pipe; and a conductive adhesive about the periphery of a bottom housing surface for mounting the housing on a matching grounded surface of a substrate.
A second aspect of the present invention is an electronic device having a shielded housing with an integrated light pipe comprising a substantially clear housing, a portion of which is arranged and constructed to form the integrated light pipe; and plating, selectively applied to the substantially clear housing, to provide for effective electromagnetic interference shielding and to allow for sufficient light into the integrated light pipe.
The electronic device further comprises a substrate comprising a grounded surface that matches the periphery of the bottom housing surface, the substrate positioned below the substantially clear housing; and a conductive adhesive about the periphery of a bottom housing surface for mounting the housing on the matching grounded surface of the substrate.
A third aspect of the present invention is a method for forming an integrated light pipe in a shielded housing for an electronic device.
The method comprises the steps of providing a substantially clear housing having an integrated light pipe portion, and selectively applying plating on portions of the substantially clear housing to provide for effective electromagnetic interference shielding and to allow for sufficient light into the integrated light pipe portion.
The method further comprises the step of applying a conductive adhesive about the periphery of a bottom housing surface for mounting the housing on a matching grounded surface of a substrate
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