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Details
Inventors: Sommers, Mathew L.;
Assignee: GELcore LLC (Valley View, OH)
Primary Examiner: Crane; Sara
Assistant Examiner:
Attorney, Agent or Firm: Fay, Sharpe, Fagan, Minnich & McKee, LLP

An LED package (10) includes LED die (12) mounted onto lead frame (14) and electrically connected thereto whereby LED die (12) is electrically energized through leads (16, 18). An encapsulant (20), preferably an epoxy resin, encapsulates and preferably hermetically seals LED die (12). Encapsulant (20) includes depression (24) defined by preselected curved surfaces (28), at least a portion of which are coated by reflective coating (26). Encapsulant (20) preferably also includes sides (22) with preselected curvature. In operation, LED die (12) emits light (32) directed approximately along LED die surface normal (36). Light rays (32) reflect from reflective surface (26) and reflected rays (38) are subsequently refracted by refracting surface (22) so that refracted rays (40) exit the capsule. The reflecting surface (26) and refracting surface (22) cooperate to convert LED die light distribution (32) into light distribution (40) which appears to emanate from an approximate point source (42).

DETAILED DESCRIPTION With reference to FIGS.
1 and 2, a preferred embodiment of the invention will be described.
The light-emitting diode (LED) package or capsule 10 includes an LED die 12 and a lead frame 14 which includes a plurality of electrical leads 16, 18.
For an LED diode there will usually be two leads 16, 18.
The terminals of the LED are electrically connected to the electrical leads of the lead frame using conventional means known to the art, such as by wire bonds (not shown).
A transparent encapsulant 20 encapsulates at least the LED die 12.
Preferably, encapsulant 20 encapsulates the LED die 12, the lead frame 14, and a portion of the electrical leads 16, 18 as illustrated in FIGS.
1 and 2.
Furthermore, encapsulant 20 preferably hermetically seals the LED die 12 to prevent corrosion or degradation of the die from the outside environment, while providing sufficient heat transfer to prevent overheating of the LED die during operation.
Encapsulant 20 has a preselected shape which is preferably essentially hemispherical, but which preferably includes side portions 22 having a preselected curvature, and a depression 24 located essentially opposite to LED die 12.
A reflective coating 26 is disposed upon a portion of the outer surface 28 of encapsulant 20.
Reflective coating 26 may be any coating which is reflective and durable, and which is compatible with the encapsulant 20 material.
In the preferred embodiment a silver oxide is used for reflective coating 26.
The reflective coating is preferably disposed within and around top depression 24 essentially opposite to the surface 30 of LED die 12.
Having thus described the physical structure, the optical operation of the LED package will now be discussed with continuing reference to FIGS.
1 and 2.
When powered by an appropriate external electrical source (not shown) through electrical leads 16, 18, LED die 12 emits light with a certain distribution of light intensity.
The emitted light is represented in FIGS.
1 and 2 by a plurality of light rays 32, 34



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