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Optical device for an optical element and apparatus employing the device
| Details |
Inventors: Osumi, Yoshimasa; Matsui, Akira; Kiyomoto, Hironobu;
Assignee: Omron Corporation (Kyoto, JP)
Primary Examiner: O'Shea; Sandra
Assistant Examiner: Alavi; Ali
Attorney, Agent or Firm: Rosenthal & Osha L.L.P.
An optical device for an optical element to control a light path about emission light emitted from the optical element to external or incident light entered from external to the optical element, which includes a light reflecting member, a resin member covering a light reflection surface of the light reflecting member, and a bumper member interposed between the light reflecting member and the resin member. The resin member is provided with a boundary surface for almost totally reflecting light deviated from a predetermined region in front of the optical element, and the boundary surface of the resin member or the light reflecting member is so disposed that light deviating from the predetermined region in front of the optical element and passing between the optical element and an external of the optical device is reflected more than once with each of the boundary surface and the light reflecting member. |
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DETAILED DESCRIPTION Referring, now, to FIG.
1, there is shown a schematic view of a light emitting apparatus or light emission device (an optical apparatus) as a first embodiment of this invention.
This light emission device includes a light emitting element chip 11 such as a light emitting diode (LED), a semiconductor laser (LD) or the like, a lead frame 12 on a saucer portion of which the light emitting element chip 11 is die bonded, and another lead frame 13 connected with the light emitting element chip by a bonding wire 14.
There are further disposed a light reflecting member 15 around the lead frames 12 and 13, and a mold resin 16 sealing these members.
While reference is made in the following embodiments to a mold resin 16, it is apparent to one of ordinarily skill in the art that other resins may be used are expressly within the scope of the present invention as "resin members," as used herein.
In the light emission device, a direct emission region 17 forming a convex lens having a spherical lens-shape, an a spherical lens shape, or paraboloid shape is disposed at a center of a light emission side of the mold resin 16, and the light emitting element chip 11 is located in a focal point of the direct emission region 17 or its neighborhood.
Accordingly, light emitted from the light emitting element chip 11 and directed to the direct emission region 17 is forwardly emitted approximately in parallel from a front wall of the mold resin 16.
A planar total reflection region 18 is formed around the direct emission region 17 to surround the same.
The angle viewed from the element chip 11 which is made by an optical axis of the light emitting element chip 11 and a direction to a border between regions 17 and 18 is designed to be equal to or greater than the critical angle of total reflection between mold resin 16 and air.
Therefore, in the light emitted from the light emitting element chip 11, light directed to the total reflection region 18 is totally reflected with boundary surface of mold resin 16, and further reflected by the light reflecting member 15 to be emitted forwardly from the total reflection region 18 as shown by arrow-marked light paths 19
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