Organic light-emitting panel and manufacturing method thereof

DETAILED DESCRIPTION An objective of the invention is to provide an organic light-emitting panel, in which the heat dissipation paths may be increased and the radiation area may be enlarged so as to avoid warpage of the rear board and facilitate the adhesive dispensing process, and a manufacturing method of the panel.
To achieve the above-mentioned objective, the invention provides an organic light-emitting panel including a rear board, a heat spreader and a front board.
The rear board has a first surface and a second surface opposite to the first surface.
The heat spreader covers over the first surface of the rear board and extends to the second surface of the rear board.
The heat spreader, which covers over the first surface of the rear board is formed with plural holes.
The front board is set on the heat spreader and the first surface of the rear board.
In addition, the invention also provides a manufacturing method of the organic light-emitting panel.
The method includes the steps of: fitting a rear board into a heat spreader in a such manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and adhering a front board to the first surface of the rear board and the heat spreader.
Compared to the prior art, owing to the increased heat dissipation paths and enlarged radiation area, heat generated from the front board may be effectively transferred to the rear board and then dissipated.
In addition, since the rear board is fitted into the heat spreader with the second surface of the rear board partially exposed, stresses generated during the warpage of the rear board may be absorbed and the dimensional stability of the rear board may be enhanced.
Therefore, the drawbacks caused by the warpage of the rear board may be overcome.
Furthermore, since the heat spreader is formed with plural holes, it is possible to prevent the conductive adhesive from overflowing during the adhesive dispensing process, and good smoothness of the conductive adhesive may be obtained