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Power-inverter-with-heat-dissipating-assembly

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Power inverter with heat dissipating assembly

Details

Inventors: Hussaini, Saied;
Assignee: Rally Manufacturing, Inc. (Miami, FL)
Primary Examiner: Chervinsky; Boris
Assistant Examiner:
Attorney, Agent or Firm: Liniak, Berenato, Longacre & White

The invention is a power inverter having a heat dissipating assembly. A heat sink plate is supported on the printed circuit board in a spaced configuration so that a space exists between the heat sink plate and the outer housing. The printed circuit board assembly includes mosfets inserted into the printed circuit board and electrically connected thereto. The heat sink plate abuts against a first side of the mosfets at an upper end of the mosfets to directly absorb heat from the mosfets. The exterior surface of the housing is provided with a plurality of heat dissipating fins to further enable heat dissipation.

DETAILED DESCRIPTION The invention is a power inverter having a heat dissipating assembly.
The assembly includes a housing having a top wall and two opposing side walls, and a printed circuit board assembly supported within the housing.
The printed circuit board assembly comprises a printed circuit board equipped with power converting components.
A heat sink plate is supported on the printed circuit board in a spaced configuration so that a space exists between the heat sink plate and the printed circuit board.
The printed circuit board assembly includes a plurality of mosfets inserted into the printed circuit board.
The mosfets are connected to the circuitry of the power converting components, and the heat sink plate abuts against a first side of the mosfets at an upper end of the mosfets.
This creates the space that exists between the heat sink plate and the printed circuit board.
The heat sink plate is secured to the first side of the mosfets by a support bar abutting against an opposing side of the mosfets by screws passing through the support bar and the heat sink plate.
The heat sink plate is L-shaped and a side wall of the heat sink plate is mounted perpendicularly to the printed circuit board.
A top wall of the heat sink plate extends above the printed circuit board assembly parallel to the printed circuit board.
An interior top surface of the top wall of the housing is substantially parallel to the top wall of the heat sink plate so that a ventilation space exists between the entire top wall of the heat sink plate and the interior top surface of the housing.
This ventilation space allows heat from the heat sink plate to dissipate to air in the ventilation space before dissipating to the housing.
A second ventilation space exists between the side wall of the heat sink plate and an interior surface of the side wall of the housing adjacent thereto.
The power inverter assembly further includes a front end plate and a rear end plate secured to the housing in a manner so as to enclose the printed circuit board assembly and the heat sink plate

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