DETAILED DESCRIPTION It is an objective of the present invention to overcome the disadvantages of the prior art as set out above, by providing semiconductor light-emitting devices capable of emission wavelengths in the range extending from the blue to the ultra-violet regions of the spectrum. In order to achieve this objective, a semiconductor light-emitting device according to the present invention has a structure that is based on an n-type semiconductor layer formed of a (ZnCd)(SSe) compound, and a p-type layer formed of a Cu(AlGa)(SSe). sub. 2 or (ZnCd)Ga. sub. 2 (SSe). sub. 4 compound, epitaxially formed successively on a substrate, with each layer having an identical value of lattice constant to that of the substrate. In the case of a semiconductor laser, an activation layer formed of a Cu(AlGa)(SSe). sub. 2 type of compound is sandwiched between the p-type and n-type layers. More specifically, according to a first aspect, a semiconductor light-emitting device according to the present invention, constituting a semiconductor laser, comprises a substrate and a combination of semiconductor layers disposed on the substrate in a double heterostructure laser configuration, the layers comprising: a p-type semiconductor cladding layer formed of Cu(Al. sub. a Ga. sub. 1-a)(S. sub. b Se. sub. 1-b). sub. 2 where 0. ltoreq. a. ltoreq. 1 and 0. ltoreq. b. ltoreq. 1; an n-type semiconductor cladding layer formed of (Zn. sub. c Cd. sub. 1-c)(S. sub. d Se. sub. 1-d), where 0. ltoreq. c. ltoreq. 1 and 0. ltoreq. d. ltoreq. 1; and an activation layer disposed between the n-type cladding layer and p-type cladding layer and formed of Cu(Al. sub. a Ga. sub. 1-a)(S. sub. b Se. sub. 1-b). sub. 2 ; each of the p-type cladding layer, n-type cladding layer and activation layer having an identical value of lattice constant to that of the substrate. According to a second aspect, a semiconductor light-emitting device according to the present invention, constituting a light-emitting diode, comprises a substrate and a p-type semiconductor layer and n-type semiconductor layer formed as successive layers on the substrate, the p-type semiconductor layer being formed of Cu(Al
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