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Silicon wafer based macroscopic mirror for wide angle scanning applications
| Details |
Inventors: Pesik, Joseph T.;
Assignee: Rosemount Aerospace Inc. (Burnsville, MN)
Primary Examiner: Cherry; Euncha P.
Assistant Examiner:
Attorney, Agent or Firm: Perclo, Esq.; David R., Calfee, Halter & Griswold LLP
A macroscopic mirror for wide angle scanning applications comprises: a silicon substrate section of a predetermined shape and macroscopic size cut from a silicon wafer comprising a flat, polished surface side and an etched, rough surface side; and a plurality of layers, including a layer of reflective medium, disposed on the flat, polished surface of the substrate section in such a manner to minimize flexural distortion of the flat surface. The macroscopic mirror is made by a method comprising the steps of: preparing the silicon wafer by polishing one side to a predetermined flatness and etching the other side to a predetermined roughness; cutting the substrate section from the prepared silicon wafer to a predetermined shape and macroscopic size; and applying the plurality of layers on the flat, polished surface. The macroscopic mirror is included in a mirror system wherein the rough surface side is bonded to supporting arms of a drive mechanism which scans the mirror at a predetermined scanning rate in at least one plane of rotation. |
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DETAILED DESCRIPTION In accordance with one aspect of the invention, a macroscopic mirror for wide angle scanning applications comprises: a silicon substrate section of a predetermined shape and macroscopic size cut from a silicon wafer comprising a flat, polished surface side and an etched, rough surface side; and a plurality of layers, including a layer of reflective medium, disposed on the flat, polished surface of the substrate section in such a manner to minimize flexural distortion of the flat surface.
In accordance with another aspect of the present invention, a method of making a macroscopic mirror for wide angle scanning applications comprises: preparing a silicon wafer by polishing one side to a predetermined flatness and etching the other side to a predetermined roughness; cutting a substrate section from the prepared silicon wafer to a predetermined shape and macroscopic size; and applying a plurality of layers, including a layer of reflective medium, on the flat, polished surface of the substrate section in such a manner to minimize flexural distortion of the flat surface.
In accordance with yet another aspect of the present invention, a mirror system for wide angle scanning a radiation beam comprises: a macroscopic mirror comprising: a silicon substrate section of a predetermined shape and macroscopic size cut from a silicon wafer, the substrate section comprising a flat, polished surface side and an etched, rough surface side; and a plurality of layers, including a layer of reflective medium, disposed on the flat, polished surface of the substrate section in such a manner to minimize flexural distortion of the flat surface; a mirror drive mechanism including a plurality of supporting arms; and wherein the rough surface side of the macroscopic mirror being bonded to the supporting arms of the drive mechanism, the mirror drive mechanism for scanning the macroscopic mirror at a predetermined scanning rate in at least one plane of rotation.
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