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Test fixture wiring integrity verification device
| Details |
Inventors: Jenkins, Jack E.; Maillet, William R.;
Assignee: ATG-Electronics Inc. (Robbinsville, NJ); Maillet; William (San Jose, CA)
Primary Examiner: Karlsen; Ernest F.
Assistant Examiner:
Attorney, Agent or Firm: Haefliger; William W.
A wiring test system in which test probes are to be oriented to engage contact points on a production circuit board, a wiring integrity verification plate comprising, in combination: a thin insulative base plate, multiple contact pads and leads attached to the plate; each of the leads extending between and interconnecting two of the contact pads, whereby multiple circuit sections are formed on the board, each circuit section including two pads interconnected by a lead; the two pads of each circuit section respectively located to be contacted by the probes of the wiring test system for providing an electrical continuity test via that circuit section, when those two probes are correctly located relative to contact points on production circuit board for testing the production circuit board. |
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DETAILED DESCRIPTION Referring first to FIG.
3, test probes 10 are to be oriented to engage contact points 11 on a production circuit board 12.
The latter, and the probes in initial positions, are shown in broken lines.
The problem is to rapidly and accurately locate the probes to be downwardly engageable with the correct contact points 11, and to verify that the probes are then, indeed, correctly positioned or oriented.
See the full line correct positions of the probes at 10a in FIG.
3, in alignment with points 11.
In accordance with the invention, a wiring integrity verification plate means is provided, as for example at 15 in FIGS.
1-3.
That plate means is shown to include a thin, insulative base plate 16, which may consist for example of fiber glass or synthetic resinous material.
Attached (as by bonding) to the plate are multiple contact pads 17 and narrow leads 18, these being electrically conductive, and metallic for example.
Each lead 18 extends between and interconnects two, and only two, of the circular contact pads, whereby multiple circuit sections are formed on the board, each such section including two pads 17 interconnected by one lead.
See FIG.
2 in this regard.
Pad 17' in FIG.
2 is not connected to the lead 18 but is offset therefrom, as seen in FIG.
1.
Note the many such pairs (for example pair 17a--17a interconnected by lead 18a, pads 17b--17b interconnected by lead 18b, etc.
).
Note that the pads are of the same size, and the leads are of lesser width than the pad diameters.
FIG.
2 shows a test current source 20 connected at 21 and 22 with the two probes 10a and 10a contacting the two conductive pads 17 (for example silver solder, as is lead 18).
When switch 23 is closed, a conductive circuit is established and meter M verifies that conductivity, verifying that the probes 10a are correctly positioned, in axial alignment with the axes 24 that pass through the tops of the domed pads 17, and also through the contact points on the production board circuitry, those points typically being small
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Light Fixtures 
