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 Apparatus for practising temperature gradient zone melting

Details
Inventors: Fielding, John O.; Erikson, Carl A.; Anthony, Thomas R.; Cline, Harvey E.; Ludke, Siegwalt;
Assignee: General Electric Company (Schenectady, NY)
Primary Examiner: Goldberg; Elliot A.
Assistant Examiner: Roskoski; Bernard
Attorney, Agent or Firm: Winegar; Donald M., Davis, Jr.; James C., MaLossi; Leo I.

An apparatus for practising temperature gradient zone melting simultaneously on a plurality of semiconductor bodies comprises a closable work chamber for receiving the bodies for processing; a heat source disposed in the work chamber and comprising a first closure member thereof; a heat sink disposed in the work chamber and comprising a second closure member thereof and means for transferring one or more bodies of semiconductor material to the work chamber for processing and from the work chamber subsequent to processing. The transferring means comprises manipulative means for selectively engaging the semiconductor bodies and supporting the bodies in transit and drive means for moving the manipulative means toward and away from the work chamber and orienting the manipulative means with respect to the semiconductor bodies.

DETAILED DESCRIPTION These and other objects apparent from the following detailed description taken in connection with the appended claims and accompanying drawings are attained by providing an apparatus for practising temperature gradient zone melting simultaneously on a plurality of semiconductor bodies which apparatus includes a closable work chamber for receiving the bodies for processing; a heat source disposed in the work chamber and comprising a first closure member thereof and a heat sink disposed in the work chamber and comprising a second closure member thereof.
The closure members are mutually separable by a first actuator such as, for example, an hydraulic actuator.
The apparatus also includes a means for transferring one or more bodies of semiconductor material to the work chamber for processing and from the work chamber subsequent to processing.
The transferring means comprises manipulative means for selectively engaging the semiconductor bodies and supporting the bodies in transit and drive means for moving the manipulative means toward and away from the work chamber and orienting the manipulative means with respect to the semiconductor bodies and other work stations.
The manipulative means comprises a plurality of vacuum lines of attaching to an equal number of semiconductor bodies by suction and an actuator for bringing the vacuum lines into contact with the semiconductor bodies.
The drive means comprises a carriage upon which the manipulative means are supported and an electric drive for propelling the carriage along a track extending approximately from the work chamber.
Other work stations or means for storing the semiconductor bodies prior to processing and for receiving the semiconductor bodies subsequent to processing are also disclosed.
The storing means includes a series of gas jet nozzles for separating adjacent semiconductor bodies within a single stack thereof to ensure that the manipulative means removes only one body at a time from the stack.



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