Method and apparatus for preheating semiconductor chips

DETAILED DESCRIPTION This invention was created to solve the above-described problems.
The purpose of this invention is to provide a preheating method and apparatus for heating a plurality of chips immediately before bonding and thereby preventing a decrease in temperature and for accurately bonding chips by adjusting for the movement of the chips during ejection of the magazine.
In order to achieve the above objects, according to one aspect of the present invention, there is provided a preheating method for the semiconductor chips comprising sequentially mounting a plurality of chips on a rotary table, heating the semiconductor chips on the rotary table for a predetermined time, and sequentially ejecting the heated semiconductor chips from the rotary table.
According to another aspect of the present invention, there is provided a preheating apparatus for the semiconductor chips comprising a rotary table, a primary driving means for rotating the rotary table, a feeding means for feeding the semiconductor chips to the rotary table, a heating means for heating the semiconductor chips on the rotary table, a secondary driving means for driving the heating means to intermittently make contact with the rotary table so that the semiconductor chips are heated when the rotary table is not rotated, and an ejecting means for ejecting the heated semiconductor chips from the rotary table.