Charge coupled device package

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT FIG.
4 shows a printed circuit interconnection frame of the present invention.
A number of printed conductors 20 are plated on an inslating substrate 10.
Each plated conductor forms an independent conductor 20.
The inner ends 21 of the conductor are used to connect the output terminals of an image sensor chip.
The outer ends of the conductor 20 is connected to a plated via hole 23, which, in turn, is connected to the bottom side of the substrate 10.
FIG.
5 shows an enlarged view of the conductor 20.
The inner end of the conductor is used to connect to an output terminal of an image sensor chip.
The output end of the conductor 20 wraps over the via hole as shown in FIG.
6 and forms a pad 22 at the bottom side of the substrate 10, which constitutes the output terminal of the image sensor chip 50.
FIG.
7 shows a cutaway view of the image sensor package according to the present invention.
An image sensor chip 50 is mounted on the center part of the substrate 10.
A bonding wire 40 is used to bond the end 21 of the independent conductor 20 to an output terminal of the image sensor chip 50.
Transparent glue 30 is used to seal the image sensor chip 50, the bonding wire 40 and the conductors 20 to the substrate 10.
The external connection to the image sensor chip 50 is through the pad 22 at the bottom of the substrate.
The biggest difference of the present invention is the elimination of the "lead frame" used in a conventional IC package.
Instead, this invention uses a "printed wiring frame".
The package of the present invention does not have any pins protruding out from the package.
The present invention may use an image sensor chip with output pads facing upward, which are then wire bonded to the conductor 20.
The image sensor chip 50 may also be soldered directly to the end 21 of the conductor 20, thus eliminating the wire-bonding step.
The bottom of the image sensor chip 50 can be mounted on a heat dissipating pad to reduce the temperature of the IC chip