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MEMS with flexible portions made of novel materials
Micromechanical Structure Fabrication: Processes for microfabricating a MEMS device such as a movable micromirror and mirror array are disclosed in U.S. Pat. Nos. 5,835,...
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Solid-state image pickup device and fabrication method thereof
An object of the present invention is to provide a solid-state image pickup device intended to increase the accumulated charge capacity, increase the area of a light ...
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Optical component package
The invention is an optical package including an optical component assembly comprising a substrate and an optical component bonded to a major surface of the substrate. T...
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Method of fabricating a microelectronic device package with an integral window
OF THE INVENTION The present invention relates to a method of fabricating a package having an integral window, for packaging at least one microelectronic device. The ...
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Circuitry for image sensors with avalanche photodiodes
An first object of the present invention is a in-pixel circuit architecture for APDs operating in the linear regime that takes advantage of a large number of in-pixel CMO...
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Process for fabricating stiction control bumps on optical membrane via conformal coating of etch holes
One chronic problem associated with micro electromechanical system (MEMS) membranes in general is stiction. Specifically, if deflected sufficiently to contact an ...
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Apparatus and method for forming a battery in an integrated circuit
The present invention provides an electrochemical structure within an integrated circuit, comprising: a semiconductor wafer; a layer of electronic devices on the ...
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Single-poly 2-transistor based fuse element
The present invention achieves technical advantages as an electrically programmable transistor fuse having a source and drain disposed in a semiconductor substrate and ...
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Image sensor using a thin film photodiode above active CMOS circuitry
An image sensor comprising a first conductive layer, which is part of a circuitry of an integrated circuit device. A light sensing device is disposed vertically atop the ...
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Method for fabricating a semiconductor device
A means for solving the problems described above will now be explained with reference to FIG. 1. A translucent, insulating thermal conductive layer 2 is provided in ...
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