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Electronic component and method of production thereof
| Details |
Inventors: Furukawa, Osamu; Chiyoma, Hitoshi; Yabukawa, Kazuhisa; Donuma, Kenichi;
Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP)
Primary Examiner: Budd; Mark O.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified. |
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DETAILED DESCRIPTION What is claimed is: 1.
A surface acoustic wave device, comprising: a printed circuit board possessing a first surface and a second surface, concave parts being formed respectively on two side surfaces thereof; a surface acoustic wave device possessing a first surface formed thereon at least a transducer portion and a second surface, the first surface thereof being disposed in an opposite relation with the first surface of the printed circuit board; a sealing member for sealing a space portion formed between the first surface of the printed circuit board and the first surface of the surface acoustic wave device while preventing the sealing member from spreading into the space portion; and a metal plate disposed in such a manner that a pair of convex portions, which engage with respective concave portions disposed on the printed circuit board, oppose each other on two leg portions, and covering the first surface of the printed circuit board and the surface acoustic wave device.
2.
A surface acoustic wave device, comprising: a printed circuit board possessing a first surface and a second surface, concave portions being formed on two side surfaces of the printed circuit board respectively, and wiring patterns being formed inside the respective concave portions; a surface acoustic wave device possessing a first surface formed thereon at least a transducer portion and a second surface, the first surface thereof being disposed in an opposite relation with the first surface of the printed circuit board; a sealing member for sealing a space portion formed between the first surface of the printed circuit board and the first surface of the surface acoustic wave device while preventing the sealing member from spreading into the space portion; and, a metal plate disposed in such a manner that a pair of convex portions, which engage to the respective concave portions disposed on the printed circuit board and connect electrically to the respective wiring patterns of the inner surface of the concave portions, oppose each other at two leg portions, and covering the first surface of the printed circuit board and the surface acoustic wave device
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MEMS 
