 Hydrogen sensor apparatus and method of fabrication |
| OF THE INVENTION Referring to FIG. 1, one type of commercial hydrogen sensor apparatus 10 ... |
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| Phased micro analyzer IV |
| What is claimed is: 1. A fluid analyzer comprising: a concentrator having a first solid-state thin-... |
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| Method for forming Cu In Se.sub.2 films |
| What is claimed is: 1. A method for fabricating a copper indium diselenide semiconductor film ... |
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| Rapid process for producing a chalcopyrite semiconductor on a substrate |
| This object is achieved, according to the invention, by a process for producing a chalcopyrite ... |
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| Method of manufacturing semiconductor devices |
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| Method of making compound semiconductor films and making related electronic devices |
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| Exposure method, exposure apparatus, and mask |
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| Thermal sprayed electrodes |
| The above-discussed and other drawbacks and deficiencies of the prior art are overcome or ... |
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| Inorganic dopants, inks and related nanotechnology |
| This invention includes several methods of making non-stoichiometric submicron and nanostructured ... |
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| Method of manufacturing semiconductor device |
| OF THE INVENTION Embodiments of the present invention will be described hereinafter, by referring ... |
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Flip chip image sensor package fabrication method
| Details |
Inventors: Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale;
Assignee: Amkor Technology, Inc. (Chandler, AZ)
Primary Examiner: Eley; Timothy V.
Assistant Examiner:
Attorney, Agent or Firm: Gunnison, McKay & Hodgson, L.L.P., Hodgson; Serge J.
A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package. |
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DETAILED DESCRIPTION In accordance with the present invention, an image sensor package includes an image sensor having an active area, which is responsive to radiation.
The image sensor is mounted to a substrate, which is transparent to the radiation.
The image sensor is mounted such that the active area of the image sensor faces the substrate.
During use, radiation is directed at the substrate.
This radiation passes through the substrate and strikes the active area of the image sensor.
The image sensor responds to the radiation in a conventional manner.
Of importance, the substrate serves a dual function.
In particular, the substrate is the window which covers the active area of the image sensor.
Further, the substrate is the platform upon which the image sensor package is fabricated.
Recall that in the prior art, a housing was used to support the window above the image sensor.
These housings were typically formed of ceramic, which is relatively expensive.
Advantageously, an image sensor package in accordance with the present invention eliminates the need for a housing of the prior art.
Accordingly, the image sensor package is significantly less expensive to manufacture than image sensor assemblies of the prior art.
In one embodiment, a bead is formed around a periphery of the image sensor such that the image sensor, the bead, and the substrate form a sealed cavity.
The active area of the image sensor is located and hermetically sealed within this cavity.
Hermetically sealing the active area reduces complexity and cost in the event the image sensor must be repaired or replaced compared to the prior art.
Recall that in the prior art, the housing, which hermetically sealed the image sensor, was mounted directly to the larger substrate.
Thus, removal of the housing necessarily exposed the image sensor to the ambient environment and to dust.
For this reason, the image sensor had to be repaired or replaced in a cleanroom or else there was a risk of damaging or destroying the image sensor.
In contrast, the active area is hermetically sealed as part of the image sensor package
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MEMS 
