Flip chip optical semiconductor on a PCB

DETAILED DESCRIPTION The present invention provides semiconductor devices and methods for making semiconductor devices.
In one embodiment, a semiconductor device includes a PCB, a optical semiconductor, underfill material and a barrier.
The PCB, a substrate adapted to receive the optical semiconductor, has an opening that extends from the top of the PCB to the bottom of the PCB.
The optical semiconductor is attached to the PCB such that the optical semiconductor's imaging area is facing the opening and substantially unobstructed by the PCB.
The underfill material is dispensed in between the optical semiconductor and the PCB.
The barrier is located in between the optical semiconductor and the PCB, such that the barrier surrounds the opening in the top of the PCB and is adapted to prevent the underfill material from entering the opening.
In another embodiment, a semiconductor device is constructed by first providing a PCB that has an opening that extends from the top of the PCB to the bottom of the PCB.
Then a barrier is dispensed around the opening on the top of the PCB.
Afterwards, a flip chip optical semiconductor can be coupled to the top of the PCB such that the flip chip optical semiconductor covers the opening.
Then underfill material can be dispensed in between the flip chip optical semiconductor and the PCB, whereby the barrier prevents the underfill material from going into the opening.
Finally, a transparent cover can be attached to the bottom of the PCB.