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High-density electronic package, and method for making same
| Details |
Inventors: Chung, Kevin Kwong-Tai;
Assignee: Amerasia International Technology, Inc. (Princeton Junction, NJ)
Primary Examiner: Reichard; Dean A.
Assistant Examiner: Oliva; Carmelo
Attorney, Agent or Firm: Dann, Dorfman, Herrell & Skillman, P.C.
A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected. |
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DETAILED DESCRIPTION What is claimed is: 1.
An electronic package having contacts adapted to be attached to a substrate, said electronic package comprising: at least one electronic device, said electronic device having a plurality of contacts thereon; a flexible dielectric adhesive interposer including: at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, a plurality of conductive vias through said layer of flexible dielectric adhesive, said plurality of conductive vias being in a pattern corresponding to a pattern of contacts of one of said electronic device and a substrate, wherein at least certain ones of said plurality of conductive vias correspond to ones of the contacts of said electronic device, and a metal foil on one surface of said layer of flexible dielectric adhesive, wherein said metal foil is patterned and is in electrical contact with ones of said conductive vias, wherein one of the plurality of conductive vias and the patterned metal foil includes contacts adapted to be attached to a substrate; and means for connecting the contacts of said electronic device to the certain ones of said conductive vias.
2.
The electronic package of claim 1 wherein said plurality of conductive vias are in a pattern corresponding to the pattern of contacts of said electronic device, wherein said patterned metal foil fans out from the pattern of contacts of said electronic device to the pattern of contacts of the substrate.
3.
The electronic package of claim 1 wherein said means for connecting includes connections of one of solder and electrically-conductive adhesive joining proximate corresponding ones of the contacts of said electronic device to the certain ones of said conductive vias.
4.
The electronic package of claim 1 wherein said plurality of conductive vias are in a pattern corresponding to the pattern of contacts of the substrate, wherein said patterned metal foil fans out from the pattern of contacts of the substrate to a pattern related to the pattern of contacts of said electronic device
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MEMS 
