Integrated circuit structure having a flip-chip mounted photoreceiver

DETAILED DESCRIPTION In accordance with the present invention, an IC package structure includes a photoreceiver flip-chip mounted to the package substrate in order to provide an IC package structure having a reduced size as compared with prior IC package structures.
According to one embodiment, an apparatus comprising an integrated circuit structure is provided.
The integrated circuit structure comprises a substrate and a photoreceiver.
The substrate has a first side and a second side opposite the first side and includes a first light passage area operable to allow light to pass through.
The photoreceiver has an aperture located on a first side of the photoreceiver and is flip-chip mounted to the substrate such that the first side of the photoreceiver faces the second side of the substrate.
The photoreceiver is operable to translate light signals received through the aperture into digital signals and to transmit the digital signals.
The first light passage area is aligned with the aperture of the photoreceiver such that the light signals may be received through the light passage area and into the aperture of the photoreceiver.
According to another embodiment, a substrate including a first light passage area operable to allow light to pass through is provided.
The substrate has a first side adapted to face a circuit board and a second side opposite the first side.
A photoreceiver is flip-chip mounted to the substrate such that an aperture located on a first side of the photoreceiver faces the second side of the substrate.
The aperture is aligned with the first light passage area of the photoreceiver such that light signals may be received through the light passage area and into the aperture of the photoreceiver.
The photoreceiver is operable to translate the light signals into digital signals and to transmit the digital signals.
Various embodiments of the present invention may benefit from numerous advantages.
It should be noted that one or more embodiments may benefit from some, none, or all of the advantages discussed below