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Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
It is therefore one object of the present invention to provide an improved micro-electro-mechanical device and method of manufacture therefore with a monolithic unitary ...
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Integrated optoelectronic devices having pop-up mirrors therein and methods of forming and operating same
It is therefore an object of the present invention to provide improved optoelectronic devices and methods of forming and operating same. It is another object of the ...
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Mechanical landing pad formed on the underside of a MEMS device
Although the following detailed description contains many specifics for the purposes of illustration, anyone of ordinary skill in the art will appreciate that many ...
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MEMS device and fabrication method thereof
In an effort to solve the above problems, it is a feature of an embodiment of the present invention to provide a MEMS device having enhanced reliability and a stable ...
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Differential interferometric light modulator and image display device
An aspect of the invention provides a novel light modulator, a scanner and projection optics as a system for displaying images to an observer. The system has several ...
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MEMS with flexible portions made of novel materials
Micromechanical Structure Fabrication: Processes for microfabricating a MEMS device such as a movable micromirror and mirror array are disclosed in U.S. Pat. Nos. 5,835,...
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Solid-state image pickup device and fabrication method thereof
An object of the present invention is to provide a solid-state image pickup device intended to increase the accumulated charge capacity, increase the area of a light ...
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Optical component package
The invention is an optical package including an optical component assembly comprising a substrate and an optical component bonded to a major surface of the substrate. T...
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Method of fabricating a microelectronic device package with an integral window
OF THE INVENTION The present invention relates to a method of fabricating a package having an integral window, for packaging at least one microelectronic device. The ...
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Circuitry for image sensors with avalanche photodiodes
An first object of the present invention is a in-pixel circuit architecture for APDs operating in the linear regime that takes advantage of a large number of in-pixel CMO...
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