Home | Links | Contact Us | More About Intellectual Property | Bookmark
Search patents:
Home MEMS Long-wavelength-semiconductor-light-emitting-device-and-its-manufacturing-method

 8-beam bridge-type silicon acceleration sensor and the fabricating method thereof
OF THE PREFERRED EMBODIMENT For a better understanding of the present invention, together with ...


 Transducer having a resonating silicon beam and method for forming same
The invention provides apparatus including a force transducer having a resonating beam that is ...


 Method of manufacturing an electronic part having an air-bridge interconnection
In view of the aforementioned problems, an object of the present invention is to provide an ...


 High frequency semiconductor device
A high frequency semiconductor device of the present invention includes: a substrate having a ...


 Method for manufacturing an SOI wafer
The present invention, in one aspect, provides a method for manufacturing SOI wafers, which ...


 Polymer based tunneling sensor
The present invention includes a process for fabricating a polymer based micro-machine by the ...


 Solid-state imaging device
It is an object of the present invention to provide a highly sensitive solid-state imaging device ...


 Process for making light waveguide element
Accordingly, it is an object of the invention to provide a process for making a light waveguide ...


 Focal plane arrays in type II-superlattices
OF THE DRAWINGS The active layers of photovoltaic and photoconductive type-II detectors of the ...


 Method for determining a preceding wafer, method for determining a measuring wafer, and method for adjusting the number of wafers
The first object of the present invention is determining a preceding wafer so that by using the ...


 Long-wavelength semiconductor light emitting device and its manufacturing method

Details
Inventors: Hino, Tomonori; Narui, Hironobu; Mitomo, Jugo;
Assignee: Sony Corporation (Tokyo, JP)
Primary Examiner: Ngô; Ngân V.
Assistant Examiner:
Attorney, Agent or Firm: Sonnenschein, Nath & Rosenthal LLP

For manufacturing a long-wavelength semiconductor light emitting device having excellent characteristics and long lifetime, a highly reactive gas is supplied together with a source material of As while the supply of a source material of a group III element is interrupted during the growth of a layer (GaAs optical guide layer) anteriorly adjacent to the active layer or immediately before the growth of the active layer. The highly reactive gas may be di-methyl hydrazine or ammonia (NH3), for example.

DETAILED DESCRIPTION It is therefore an object of the present invention to provide a long-wavelength semiconductor light emitting device having excellent characteristics and a long lifetime, as well as its manufacturing method, with which an active layer of a good quality can be obtained because of a sufficiently low concentration of Al impurity in the active layer.
The Inventors made vigorous researches to accomplish the above-mentioned object as abstracted below.
As a technique for solving the problems in the prior techniques, the Inventors have found that the concentration of Al impurity contained in the active layer can be reduced to 1×1019 cm-3 if the supply of the source material of a group III element is interrupted during the growth of a layer (such as an optical guide layer) anteriorly adjacent to the active layer of a GaInNAs long-wavelength semiconductor light emitting device or immediately before the start of growth of the active layer, and a highly reactive gas such as DMHy is supplied together with a source material of As used as a group V element.
The Inventors also found that the Al impurity concentration reduced to this level ensures characteristics acceptable for practical use.
This technique is completely different from techniques of Patent Literature 1 and Non-patent Literatures 2 and 3.
FIG.
1 shows correlation between the peak concentration of Al impurity in the GaInNAs active layer obtained by bar check and the slope efficiency.
FIG.
2 shows correlation between the characteristic temperature measured after assembly of the laser and the peak concentration of Al impurity in the GaInNAs active layer.
FIG.
3 shows correlation the emission intensity (peak intensity) from the GaInNAs active layer obtained by photoluminescence (PL) measurement and the peak concentration of Al impurity in the GaInNAs active layer.
Note that the reflectance of the front edge of the laser is 50% and the reflectance of the rear edge is 95%.
It is appreciated from FIGS.
1, 2 and 3 that, under the Al impurity concentration equal to or lower than 1×1019 cm-3, the slope efficiency is approximately equal to or higher than 0



Related patents
  Method of producing a diaphragm on a substrate
We claim: 1. A method of producing on a substrate a diaphragm which is electrically isolated from the substrate, comprising the steps of: (a) obtaining a substrate ...
  MEMS sensor structure and microfabrication process therefor
The present invention provides a micro-electro-mechanical sensor structure with an improved design comprising rigid interdigitated projections forming capacitive plate ...
  Electromechanical memory array using nanotube ribbons and method for making same
Preferred embodiments of the invention provide new electromechanical memory arrays and methods for making same. In particular, electromechanical memory cells are ...
  Silicon light emitting device and a method of making the device
OF THE INVENTION Referring to the Figures, a light emitting device 10 comprises a substrate 12 having first and second major surfaces 14 and 16 respectively; a region 18...
  Trench isolation method
Therefore, it is an object of the present invention to provide a trench isolation method which avoids the need for a densification process for densifying the insulating ...
  Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus
It is an object of the invention to provide a method of achieving an electrical connection between stacked semiconductor substrates with ease and high reliability as ...
  Method for producing a radiation-emitting semiconductor chip
It is accordingly an object of the invention to provide a method for producing a radiation-emitting semiconductor chip that overcomes the above-mentioned disadvantages ...
  Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation
In general, the invention disclosed refers to gas phase release of any number of microstructure layers whose movement is independent or coupled and which are ...
  Magnetoresistive element and magnetic memory device
OF THE INVENTION Basic structures of magnetoresistive elements according to the present invention will be described hereinafter, referring to FIGS. 1 to 4. FIG. 1 shows ...
  Method of fabricating DRAM capacitor
It is therefore the object of the invention to provide an improved and simplified method of fabricating DRAM capacitors. This method uses tungsten nitride as the MIM ...

0.004

Archive: All patents - Links

Copyright (c)2006 Eipa-patents.org - All rights reserved