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Methods for identifying and removing an oxide-induced dead zone in a semiconductor device structure
The following summary of the invention is provided to facilitate an understanding of some of the innovative features unique to the present invention and is not intended ...
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Article comprising a Si-based photodetector
In a general aspect the invention is embodied in an article comprising an improved Si-based photodetector. More specifically, the photodetector comprises a crystalline S...
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High conductivity buried layer in optical waveguide
According to the present invention, an optical device is provided which has an active region for radiation propagation and injecting means for injecting charge carriers ...
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Passive millimeter wave sensor using high temperature superconducting leads
OF THE PREFERRED EMBODIMENTS The present invention is best understood when considered with reference to the drawings, wherein the (not to scale) drawings are directed ...
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Method for manufacturing a semiconductor photo-sensor
It is an object of the present invention to provide a semiconductor photo-sensor having an improved characteristic which overcomes the problems encountered in the prior ...
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Conductive polymer film bonding technique
Referring to FIG. 1, a portion of a substrate is shown at 11 with an array of contact pads 12 formed e.g. by standard printed circuit techniques. The device chip or ...
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Method of paste printing using stencil and masking layer
The present invention is directed to a method for depositing a solder paste or other conductive or non-conductive material on a contact pad or other designated region of ...
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Electronic component and method of production thereof
What is claimed is: 1. A surface acoustic wave device, comprising: a printed circuit board possessing a first surface and a second surface, concave parts being formed ...
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Semiconductor package having metal-pattern bonding and method of fabricating the same
FIG. 3 is a cross-sectional view illustrating a semiconductor package according to the embodiments of the present invention. As illustrated, there are provided a ...
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Method of vacuum packaging a semiconductor device assembly
Accordingly, it is an object of the present invention to provide a semiconductor chip device package having a vacuum within interconnect voids in the semiconductor chip ...
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