Home | Links | Contact Us | More About Intellectual Property | Bookmark
Search patents:
Home MEMS Low-voltage-micro-mirror-array-light-beam-switch

 Method of fabricating DRAM capacitor
It is therefore the object of the invention to provide an improved and simplified method of ...


 8-beam bridge-type silicon acceleration sensor and the fabricating method thereof
OF THE PREFERRED EMBODIMENT For a better understanding of the present invention, together with ...


 Transducer having a resonating silicon beam and method for forming same
The invention provides apparatus including a force transducer having a resonating beam that is ...


 Method of manufacturing an electronic part having an air-bridge interconnection
In view of the aforementioned problems, an object of the present invention is to provide an ...


 High frequency semiconductor device
A high frequency semiconductor device of the present invention includes: a substrate having a ...


 Method for manufacturing an SOI wafer
The present invention, in one aspect, provides a method for manufacturing SOI wafers, which ...


 Polymer based tunneling sensor
The present invention includes a process for fabricating a polymer based micro-machine by the ...


 Solid-state imaging device
It is an object of the present invention to provide a highly sensitive solid-state imaging device ...


 Process for making light waveguide element
Accordingly, it is an object of the invention to provide a process for making a light waveguide ...


 Focal plane arrays in type II-superlattices
OF THE DRAWINGS The active layers of photovoltaic and photoconductive type-II detectors of the ...


 Low voltage micro-mirror array light beam switch

Details
Inventors: Kane, Jonathan S.; Hughes, Gareth A.;
Assignee: Computer Optics Inc (Hudson, NH)
Primary Examiner: Lee; John D.
Assistant Examiner: Doan; Jennifer
Attorney, Agent or Firm: Nathans; Robert

A micro-optical light beam switch comprises a MEMS (Micro-Electromechanical Systems) mirror array with packaged CMOS driving circuitry. Each movable mirror is coupled to orthogonal pairs of thin unimorph PZT capacitor actuators about peripheral mirror portions for precise positional accuracy in two dimensions by the application of mirror tilt control voltages of 5 volts or less to the actuators. Each cantilevered actuator is individually controllable, allowing multi-axial movement of each mirror via simple flexible stress reducing hinging tab elements for the precise redirection of an incoming light beam to the appropriate targeted location, such as the direction of optical traffic throughout a fiber optic network.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION FIG.
1a discloses a sample array of 16 micro-mirrors 6 with actuators 1a on silicon substrate 5.
FIG.
1b is an isometric view of the array of FIG.
1a.
FIG.
1c is a top view of a single mirror 6, controlled by four actuators 1a.
A small fixed portion of each actuator is attached to the substrate 7 for anchoring, such that a cantilever structure like a diving board is created.
Movable end portions of each actuator are flexibly coupled to the central mirror support via narrow flexible tabs, functioning as hinging areas 4 of the support sheet.
See also tab portions 4 in FIG.
9.
The hinging areas reduce potentially damaging actuator stress concentrations.
FIG.
1d is an isometric view of single mirror element 6.
The actual reflective mirror surface is located underneath the central square structure 6a such that the light source emits an upward light beam through the defined areas in the silicon substrate 7 and is reflected by the reflective mirror surface.
Again, each actuator, composed of a PZT capacitor 1a is anchored to the substrate 7 as shown at 7a.
FIG.
1 below shows a cross section A--A taken through FIG.
1c of the optical switch.
The support material of substrate 7 of FIG.
1, provides mechanical support for both the PZT actuators 1a and mirror (6).
The PZT actuators comprise unimorph or bimorph thin film PZT layer 2 sandwiched between upper electrode 1 and lower electrode 3 and form the cantilever structures above the thin movable support sheet member (5).
Several PZT capacitors also can be stacked to create the actuator as shown in FIG.
15.
The mirror (6) is deposited on the underside of the easily flexed support sheet (5).
Aforesaid hinge portions shaped as narrow tabs (4) are advantageously just areas within the support material located between the PZT actuators 1a and the mirror section 6, rather than discreet hinge devices.
Thus the hinges areas are integral with the flexing support sheet (5) and are sufficiently thin and hence flexible so as to act as stress relieving hinge flexing areas, relieving stress from the stiffer actuators



Related patents
  Long-wavelength semiconductor light emitting device and its manufacturing method
It is therefore an object of the present invention to provide a long-wavelength semiconductor light emitting device having excellent characteristics and a long lifetime, ...
  Method of producing a diaphragm on a substrate
We claim: 1. A method of producing on a substrate a diaphragm which is electrically isolated from the substrate, comprising the steps of: (a) obtaining a substrate ...
  MEMS sensor structure and microfabrication process therefor
The present invention provides a micro-electro-mechanical sensor structure with an improved design comprising rigid interdigitated projections forming capacitive plate ...
  Electromechanical memory array using nanotube ribbons and method for making same
Preferred embodiments of the invention provide new electromechanical memory arrays and methods for making same. In particular, electromechanical memory cells are ...
  Silicon light emitting device and a method of making the device
OF THE INVENTION Referring to the Figures, a light emitting device 10 comprises a substrate 12 having first and second major surfaces 14 and 16 respectively; a region 18...
  Trench isolation method
Therefore, it is an object of the present invention to provide a trench isolation method which avoids the need for a densification process for densifying the insulating ...
  Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus
It is an object of the invention to provide a method of achieving an electrical connection between stacked semiconductor substrates with ease and high reliability as ...
  Method for producing a radiation-emitting semiconductor chip
It is accordingly an object of the invention to provide a method for producing a radiation-emitting semiconductor chip that overcomes the above-mentioned disadvantages ...
  Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation
In general, the invention disclosed refers to gas phase release of any number of microstructure layers whose movement is independent or coupled and which are ...
  Magnetoresistive element and magnetic memory device
OF THE INVENTION Basic structures of magnetoresistive elements according to the present invention will be described hereinafter, referring to FIGS. 1 to 4. FIG. 1 shows ...

0.014

Archive: All patents - Links

Copyright (c)2006 Eipa-patents.org - All rights reserved