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| Micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same |
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| Semiconductor device |
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MEMS device and fabrication method thereof
| Details |
Inventors: Lee, Eun-sung; Kim, Chung-woo; Song, In-sang; Kim, Jong-seok; Lee, Moon-chul;
Assignee: Samsung Electronics Co., Ltd. (Kyungki-do, KR)
Primary Examiner: Chaudhari; Chandra
Assistant Examiner:
Attorney, Agent or Firm: Lee & Sterba, P.C.
A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region. |
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DETAILED DESCRIPTION In an effort to solve the above problems, it is a feature of an embodiment of the present invention to provide a MEMS device having enhanced reliability and a stable driving capability and a fabrication method thereof.
The above feature of the present invention is provided by a first embodiment wherein a method for fabricating a MEMS device having a fixing part fixed to a substrate, a driving part connected to the fixing part by a connecting part, wherein the driving part is floating over the substrate, a driving electrode for driving the driving part by a predetermined driving force, and contact parts selectively switchable with the driving part, including patterning the driving electrode on the substrate; forming an insulation layer on the substrate on which the driving electrode is formed; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer, in which the fixing part and the contact parts, respectively, are to be formed; forming a metal layer over the substrate including the fixing and contact regions; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein, wherein the MEMS structure layer forms the fixing part, the driving part and the connection part connecting the fixing part and the driving part on the sacrificial layer; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.
Preferably, the insulation layer is formed as a thick film having a thickness at least as thick as the thickness of the driving electrode so that the driving electrode is embedded in the insulation layer.
Preferably, in the step for forming the opening, the opening is substantially formed over the entire portion remaining except for the portion matched with a connection part connecting the fixing part and the driving part
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MEMS 
