 Zero-crossing triac and method |
| OF THE DRAWINGS FIG. 1 schematically illustrates a portion of a circuit suitable for implementing ... |
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| Process for producing nitride semiconductor light-emitting device |
| Therefore, the present invention has been made in view of the above problems, and it is an object ... |
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| Optical mirror system with multi-axis rotational control |
| An optical mirror system with multi-axis rotational control is disclosed. The mirror system ... |
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| Structure for an optical switch on a substrate |
| FIG. 1 shows an embodiment of optical cross-connect system 100 in accordance with the invention. T... |
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| Micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same |
| A micro-electro-mechanical-system (MEMS) mirror device is disclosed. The MEMS mirror device ... |
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| Semiconductor device |
| Objects of the Invention It is an object of the present invention to provide a semiconductor device ... |
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| Method of manufacturing spatial light modulator and electronic device employing it |
| It is the object of the present invention to provide a spatial light modulator equipped with ... |
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| Distributed constant element using a magnetic thin film |
| As described above, the development and practicability of a magnetic thin-film device are delayed. I... |
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| Charge coupled device package |
| OF THE PREFERRED EMBODIMENT FIG. 4 shows a printed circuit interconnection frame of the present ... |
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MEMS with flexible portions made of novel materials
| Details |
Inventors: Reid, Jason S.;
Assignee: Reflectivity, INC (Sunnyvale, CA)
Primary Examiner: Pham; Hoai
Assistant Examiner: Duong; Khanh
Attorney, Agent or Firm: Muir; Gregory R.
MEMS devices are provided that are capable of movement due to a flexible portion formed of unique materials for this purpose. The MEMS device can have a flexible portion formed of a nitride or oxynitride of at least one transition metal, and formed of a nitride or oxynitride of at least one metalloid or near metalloid; a flexible portion formed of a single transition metal nitride or oxynitride and in the absence of any other metal or metalloid nitrides; a flexible portion formed of one or more late transition metal nitrides or oxynitrides; a flexible portion formed of a single transition metal in nitride form, and an additional metal substantially in elemental form; or a flexible portion formed of at least one metalloid nitride or oxynitride. The MEMS devices can be any device, though preferably one with a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or micromirror arrays for direct view and projection displays. The flexible portion (e.g. the hinge of the micromirror) is preferably formed by sputtering a metal and/or metalloid target in nitrogen ambient so as to result in a sputtered hinge. It is also possible to form other parts of the MEMS device (e.g structural parts that do not flex). |
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DETAILED DESCRIPTION Micromechanical Structure Fabrication: Processes for microfabricating a MEMS device such as a movable micromirror and mirror array are disclosed in U.
S.
Pat.
Nos.
5,835,256 and 6,046,840 both to Huibers, the subject matter of each being incorporated herein by reference.
A similar process for forming MEMS movable elements (e.
g.
mirrors) on a wafer substrate (e.
g.
a light transmissive substrate or a substrate comprising CMOS or other circuitry) is illustrated in FIGS.
1 to 4.
By "light transmissive", it is meant that the material will be transmissive to light at least in operation of the device (The material could temporarily have a light blocking layer on it to improve the ability to handle the substrate during manufacture, or a partial light blocking layer for decreasing light scatter during use.
Regardless, a portion of the substrate, for visible light applications, is preferably transmissive to visible light during use so that light can pass into the device, be reflected by the mirrors, and pass back out of the device.
Of course, not all embodiments will use a light transmissive substrate).
By "wafer" it is meant any substrate on which multiple microstructures or microstructure arrays are to be formed and which allows for being divided into dies, each die having one or more microstructures thereon.
Though not in every situation, often each die is one device or product to be packaged and sold separately.
Forming multiple "products" or dies on a larger substrate or wafer allows for lower and faster manufacturing costs as compared to forming each die separately.
Of course the wafers can be any size or shape, though it is preferred that the wafers be the conventional round or substantially round wafers (e.
g.
4'', 6'', 8'' or 12'' in diameter) so as to allow for manufacture in a standard foundry.
FIGS.
1A to 1D show a manufacturing process for a micromechanical mirror structure.
As can be seen in FIG.
1A, a substrate 10 such as glass (e.
g.
Corning 1737F), quartz, Pyrex
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MEMS 
