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Manufacturing method of electro-optical device substrate and manufacturing method of electro-optical device
| Details |
Inventors: Otake, Toshihiro; Matsuo, Mutsumi;
Assignee: Seiko Epson Corporation (JP)
Primary Examiner: Schillinger; Laura M.
Assistant Examiner: Dolan; Jennifer M
Attorney, Agent or Firm: Harness, Dickey & Pierce, P.L.C.
A photosensitive resin applied onto a substrate is exposed using a mask. In this exposure step, by appropriately setting the size of each light transmitting portion formed in the mask and an exposure gap, an exposure intensity profile on a surface of a photosensitive resin is formed so as to have an increasing and decreasing curve along the surface thereof. When the exposure is performed in accordance with the exposure intensity profile, followed by development, a resin layer having surface irregularities is formed. Subsequently, a reflection layer made of a metal thin film or the like is formed on this resin layer. |
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DETAILED DESCRIPTION What is claimed is: 1.
A method for manufacturing an electro-optical device substrate, comprising: an exposure step of exposing a photosensitive resin disposed on a substrate using a mask pattern provided with a light transmitting portion and a light shading portion, the light transmitting portion further comprising light transmitting portions formed as a plurality of islands, the light transmitting portions being dispersed in the mask pattern, and the light shading portion being formed around the peripheries of the light transmitting portions such that a plurality of concave portions, which correspond to the light transmitting portions, are formed on the surface of the resin layer; a developing step of developing the exposed resin; and a reflective layer forming step of forming a reflection layer on the resin, wherein a size of at least one of the light transmitting portion and the light shading portion, and an exposure gap between the mask pattern and the resin are set so as to obtain an exposure intensity profile having an increasing and decreasing curve along a surface of the resin in the exposure step, such that, in the developing step, the resin is formed into a resin layer having surface irregularities in accordance with the exposure intensity profile; and an exposure wavelength λ in the exposure step is set in a range of 300 nm to 450 nm, a diameter of the light transmitting portions is set in a range of approximately 9 μm to 12 μm, and the exposure gap is set in a range of approximately 150 μm to 250 μm.
2.
The method for manufacturing an electro-optical device substrate according to claim 1, further comprising a transmitting portion forming step of forming transmitting portions by removing parts of the reflection layer.
3.
The method for manufacturing an electro-optical device substrate according to claim 2, wherein, in the transmitting portion forming step, the parts of the reflection layer are removed together with parts of the resin layer provided thereunder
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MEMS 
