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MEMS

Method-and-apparatus-for-detecting-wafer-flaw

Capacitance pressure sensor

The present invention relates to a microelectromechanical (MEM) capacitance pressure sensor ...

Process for microfabrication of an integrated PCR-CE device and products produced by the same

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Process for manufacturing buried channels and cavities in semiconductor material wafers

The embodiments of the present invention provide a process that eliminates the disadvantages of the ...

Integrated device for microfluid thermoregulation, and manufacturing process thereof

According to the embodiments of the present invention, an integrated device for microfluid ...

Method of forming pattern

Accordingly, the present invention is directed to a method of forming a pattern that substantially ...

Thin film piezoelectric element, method of manufacturing the same, and actuator

The present invention aims to improve the reproducibility of the shape of piezoelectric elements in ...

Apparatus for stress relieving liquid crystal displays

What is claimed is: 1. A pressure tolerant liquid crystal device comprising: a first unitary ...

Flat display device

OF THE INVENTION Semitransmission liquid crystal display devices according to preferred ...

Method for making an all-silicon capacitive pressure sensor

It is an object of this invention to provide an improved method for fabricating an all-silicon ...

Microfabricated ultrasonic immersion transducer

It is an object of the present invention to provide an immersion microfabricated ultrasonic ...

Method and apparatus for detecting wafer flaw

Details

Inventors: Chen, Chih-Kun; Kung, Yao-Hsiung; Lo, Tun Yuan;
Assignee: Nan Ya Technology Corporation (TW)
Primary Examiner: Williams; Hezron
Assistant Examiner: Miller; Rose M.
Attorney, Agent or Firm: Birch, Stewart, Kolasch & Birch, LLP

The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.

DETAILED DESCRIPTION An object of the present invention is to provide a detecting apparatus that can sift the abnormal wafer out immediately and quickly before wafer polishing beforehand so as to reduce the wafer broken during manufacturing.
In order to achieve the above objects, the present invention provides an apparatus for detecting flaws in a wafer.
The apparatus comprises a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.

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