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| Electrically programmable resistance cross point memory |
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| Multiple color detection elevated pin photo diode active pixel sensor |
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Method and apparatus for preparing a plurality of dice in wafers
| Details |
Inventors: Headley, William R.; Paniccia, Mario J.;
Assignee: Intel Corporation (Santa Clara, CA)
Primary Examiner: Blum; David S.
Assistant Examiner:
Attorney, Agent or Firm: Blakely, Sokoloff, Taylor & Zafman LLP
An apparatus and method for preparing a plurality of dice on a semiconductor wafer. In one embodiment, a method according to embodiments of the present invention includes arranging a plurality of dice in a semiconductor wafer such that there is a separation region between each neighboring die of the semiconductor wafer. One or more trenches are etched in the separation region of the semiconductor wafer to form one or more lateral surfaces of one or more of the plurality of dice. The semiconductor wafer is then fractured into separate pieces at the one or more trenches to separate the plurality of dice from each other. |
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DETAILED DESCRIPTION Methods and apparatuses for modulating an optical beam in an optical device are disclosed.
In the following description numerous specific details are set forth in order to provide a thorough understanding of the present invention.
It will be apparent, however, to one having ordinary skill in the art that the specific detail need not be employed to practice the present invention.
In other instances, well-known materials or methods have not been described in detail in order to avoid obscuring the present invention.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention.
Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment.
Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments.
In addition, it is appreciated that the figures provided herewith are for explanation purposes to persons ordinarily skilled in the art and that the drawings are not necessarily drawn to scale.
In one embodiment of the present invention, improved techniques for preparing wafers of having a plurality of dice are disclosed.
In one embodiment, the plurality of dice are arranged on a silicon-on-insulator (SOI) wafer and at least some of the dice include photonic devices such as for example waveguides having facets along the edges of the dice.
As will be discussed, the dice are separated by fracturing the wafers in separation regions that are deep trenched etched according to embodiments of the present invention.
In addition, the wafers are anti-reflection (AR) coated prior to fracturing the wafers such that the facets of any waveguides along the edges of the dice have reduced reflections.
To illustrate, FIG
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MEMS 
