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Method for manufacturing a semiconductor photo-sensor
| Details |
Inventors: Yoshizawa, Tetsuo; Mihara, Akio; Yamashita, Hiromichi; Ohnuki, Ichiro; Suda, Yasuo; Ohtaka, Keiji; Sato, Toshiaki; Sugimoto, Taichi;
Assignee: Canon Kabushiki Kaisha (Tokyo, JP)
Primary Examiner: Picardat; Kevin M.
Assistant Examiner:
Attorney, Agent or Firm: Fitzpatrick, Cella, Harper & Scinto
In a method for manufacturing a semiconductor photo-sensor, an assembly including a photoelectric conversion element having a photoreceiving section, and a lead terminal having an inner lead connected to the photoelectric conversion element by a bonding wire is provided. A light transmitting member is also provided within the cavity spaced apart from the photoelectric conversion element and at a light-incident side of the photoelectric conversion element, the light transmitting member having an inner surface facing an upper surface of the photoelectric conversion element and an outer surface opposite the inner surface. The photoelectric conversion element, the inner lead and the bonding wire are sealed by introducing a light transmitting resin into the cavity so as to provide a relation l<2.multidot.(d.sub.1 +d.sub.2).multidot.tan.theta..sub.1, wherein l is a length of the photoreceiving section of the photoelectric conversion element, d.sub.1 is a thickness of the light transmitting resin above the upper surface of the photoelectric conversion element, d.sub.2 is a thickness of the light transmitting member, and .theta..sub.1 is a total reflection angle of the outer surface of the light transmitting member. |
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DETAILED DESCRIPTION It is an object of the present invention to provide a semiconductor photo-sensor having an improved characteristic which overcomes the problems encountered in the prior art semiconductor photo-sensors.
It is another object of the present invention to provide a semiconductor photo-sensor sealed by light transmitting resin in which electrical signals derived from a plurality of photo-sensing cells of a photo-electric conversion element are equal.
It is another object of the present invention to provide a semiconductor photo-sensor sealed by light transmitting resin in which an electrical signal from a photo-sensing cell is not attenuated even if there is a defect on a surface of the light transmitting resin.
It is a further object of the present invention to provide a method for manufacturing a semiconductor photo-sensor sealed by light transmitting resin and having a light transmitting member such as an optical filter mounted on a light transmission surface of the sealant, which allows a good optical characteristic between the sealant and the light transmitting member, and high manufacturing yield and low manufacturing cost.
In order to achieve the above objects, the semiconductor photo-sensor of the present invention has a thickness between a transparent area through which light is directed to the photo-conversion element having a plurality of photo-sensing cells and a photo-sensing surface of the photo-electric conversion element and a shape of the transparent area which are so designed that effects of a light reflected by a photo-sensing cell of the photo-electric conversion element, further reflected by the transparent area and then directed to other photo-sensing cells, and a light reflected by a periphery of the photo-sensing cells of the photo-electric conversion element, further reflected by the transparent area and then directed to the photo-sensing cells, are reduced.
In accordance with the present invention, the method for manufacturing the semiconductor photo-sensor comprises the steps of: mounting a light transmitting member at a predetermined position on a mold; holding a semiconductor photo-sensor element comprising a photo-electric conversion element, electrical connection means and lead terminals excluding external leads, in facing relation to the light transmitting member; injecting light transmitting resin into the mold to seal the semiconductor sensor element and bonding the light transmitting member by the sealant
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MEMS 
